電子封面 的英文怎麼說
中文拼音 [diànzifēngmiàn]
電子封面
英文
electronic cover-
This product is the newest filming technique, the latest achievement of usa electronic magic, it utilizes decomposition principle of electronic material to form a positive negative ions film on the surface of car coating, which has high water repellency and makes the surface of coat has more than 95 % brightness of mirror surface, lt has preeminent performance on weathering resistance, ageing resistance, oxidation resistance static resistance and wear resistance, with the force of charged ions, this product can easy removes the dirt, water drop acid rain and grease on the surface of the film and perennially and effectively protect coat surface, lt is the fourth generation car beauty and protective product which replaces glaze sealing products
本品屬于當今最新的鍍膜技術,屬美國電子工學魔法的最新成果,它利用電子物質的分解原理,在車漆表面生成持有高撥水性的正負離子覆膜,使漆面光亮度可達鏡面光澤的95 %以上,並具有超強的耐候性、抗老化、防氧化、防靜電、耐磨性極好的功能,它利用電離子的力量,可輕松彈去覆膜表面的污垢、水滴、酸雨、油脂等,平時只需清水沖洗,便可立即使之恢復離子效應,達到長期保護漆面的目的,是取代封釉的第四代汽車美容保護產品。The challenge of changeover to lead - free in electronic packaging
電子封裝面臨無鉛化的挑戰The second part, a renewable piezoelectric immunosensor is developed for the antibody of schistosoma - japonicum ( sjab ). after incubating 32 kd molecular antigens of schistosoma japonicum ( sjag ) on the qcm by applying the immobilization above, the nonspecific sites on the immunosensor are sealed by using bsa and nrs together. the immunosensor can detect the sjab with the linear range of 0. 54 ~ 32. 50 ug / ml
以感染兔血清為檢測對象,採用聚電解質吸附固定法,將日本血吸蟲分子抗原( siag32kd )固定於石英晶振表面,再以牛血清白蛋白( bsa )和正常兔血清( nrs )聯合封閉晶振上非特異性活性位點,可在0 . 54 32 . 50ug ml范圍內檢測感染兔血清中日本血吸蟲抗體。In the part of detector, it mainly introduces the design of liquor tubes, heater, pressurize, and thermocouple ; in the part of controller, this design uses tms320lf2407 as the cpu. the design part mainly introduces controller circuit design which mainly contains data collection circuit, prepositive magnifying circuit, a / d convert circuit, failure self - diagnosis circuit, the tms320lf2407 interface circuit, temperature control circuit, display circuit, 4 ~ 20ma standard signal output circuit ; in the software part, it mainly introduces software chart of main program and partly linearization subprogram design
檢測器部分重點介紹了導流管的設計、加熱器的設計、密封技術的設計以及測溫電路的設計;控制器部分以tms320lf2407為核心,重點介紹了控制器電路設計,主要包括數據選擇電路、前置放大電路、 a / d轉換電路、故障自診斷電路、 tms320lf2407介面電路、控溫電路、顯示電路、 4 20ma標準信號輸出電路共八個部分;軟體設計重點介紹了主程序軟體設計及分段線性化子程序設計。A worker looks out from the workshop at a electronic product factory in shanwei of guangdong, china
一個工人在一間全封閉的高科技電子車間內向外張望,裏面昏黃的燈光讓他與這個世界緊緊相連。For special example, the closed form solutions for complex potentials in matrix and inhmogeneity regions are derived explicitly when interface containing single crack or rigid line, and the appropriate expressions of the electro - elastic field intensity factors at the tip of crack or rigid line are examined
作為特例,求出了界面含一條裂紋或剛性線夾雜時基體和夾雜區域復勢的封閉形式解;同時計算了界面裂紋和剛性線尖端應力和電位移場強度因子。The most recognized form of digital wrappers are digital envelopes. those pieces of code are the workhorses of e - mail encryption, locking out intruders who don ' t have the right digital key to open the envelope. the digital envelope is essentially made up of code encrypted with a cipher, or software algorithm, and carries a digital signature that properly identifies the sender to the recipient
數字包裝器最被認可的形式是數字信封,這些代碼主要完成電子郵件的加密,把想打開信封而沒有正確數字密鑰的入侵者擋在外面,數字信封主要由通過密碼加密或軟體演算法加密的代碼組成,運載著能正確讓接收方識別發送方身份的數字簽名。Using the knowledge of mechanics and transducer, three signal induce parts were developed to measure three kinds of singals in effect. the researchers designed the hardware part on the basic of the knowledge of electron and electrocircuit, the computer principle and the intelligent designing theory
同時,根據電子電路知識、計算機控制原理及智能化儀表的設計思想,採用現代儀器設計中的器件解決方案,對灌封系統的核心硬體控制部分進行了較為全面的設計。Use a related audio clip to help communicate your point, cover a case study or example that is related to your ebook
使用相關音頻夾幫助你溝通點封面個案研究,或者是與你來說電子書This paper mainly described the research on rheological property, high thermal stability, flame retardant, the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials, which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要綜述了國內外用於電子元器件、大規模集成電路等高科技領域的有機硅灌封材料在流動、耐高溫、阻燃和絕緣導熱等方面的性能以及催化劑對灌封材料的影響的研究應用進展。A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip
提出了一種通過特定的扁平小矩形路徑j積分,計算電子封裝中異質界面分層裂縫擴展能量釋放率的新方法。Secure print, proof print, saved print, personal print, job completion notification, edge - to - edge printing, booklet printing, negative and mirror images, scaling, auto fit, watermarks, custom size paper, cover pages, collation, remote printing, separation pages, n - up printing, image smoothing, pdfdirect printing, saved job repository, mailinx e - mail alerts requires hard disk operating
安全列印校樣列印存儲列印個人列印作業完成通知邊到邊列印小冊子列印負片圖像與鏡像縮放自動匹配水印定製尺寸紙張封面頁分頁遠程列印分隔頁多張合一列印圖像平滑處理pdf直接列印列印作業磁盤存儲mailinx電子郵件提醒須有硬盤。In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows
論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容,最後為實現封裝設計標準化和自動化,研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。Because the calculation of j - integral is much simpler than other method, and the multilayers and interfaces are ubiquitous in microelectronic packaging structures, it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging, especially
並通過實例證明,此新方法對于界面分層問題是可行的。由於j積分計算十分簡便,因此扁平小矩形路徑j積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應用。Ic and optoelectronics packaging ; flip chip technology ; surface mount technology
集成電路及光電子封裝;倒扣晶元技術;表面貼裝技術" the cover of the hksar e - passport will basically be the same as the existing passport save for the addition of an electronic travel document symbol on the front cover in accordance with the standard of icao, signifying that the passport contains a chip while the bio - data page of the e - passport is made of polycarbonate, " the spokesman said
發言人說:特區電子護照的封面設計基本上與現時的護照相同,只是按照國航組織的標準,加入電子旅行證件的標志以表示護照內置晶片;而電子護照的個人資料頁會以聚碳酸不碎膠製成。It has been proved by user that the sealing surface of valves processed by laser cladding have better property of anti - abrasive, anti - acid, anti - high - temperature, and, have the longer life
國內對一些高參數閥門的關鍵密封面一般採用等離子噴焊,電弧、火焰堆焊等傳統工藝進行強化1 。With the application of robots extending to ic manufacture, ultra - precision machining and high - precision machine assembly, there are more and more demands on speed, precision and efficiency for robots
隨著機器人的應用領域深入到微電子封裝、超精密加工、精密裝配等方面,人們對機器人的速度、精度、效率等提出了越來越高的要求。" long - term thinking does not come naturally to most people - let alone to gms of contending teams, " he wrote in an e - mail. " but building from within is far more rewarding in the long run on every level
大部分人都不會有長遠的打算,更何況是全力奪冠球隊的行政經理,他寫了一封電子郵件提到,但在各個層面而言由球團內部打造球隊是長期大大地受用不盡,長期的目標是建立一個自給自足的球團,而不是僅僅一時徵集的25位球員。As he reads through the more than 2, 500 e - mails that have arrived since he started firma, mr mlodkowski notes that the biggest problem faced by new business is a lack of demand
自從「創業指南」節目開辦以來,他共收到2500餘封電子郵件,在閱讀電子郵件中他發現,新企業面臨的最大問題是缺乏需求。分享友人