電子組裝 的英文怎麼說

中文拼音 [diànzizǔzhuāng]
電子組裝 英文
electronic packaging
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 電子 : [物理學] [電學] electron
  • 組裝 : package; assembling; packaging組裝車間 composing room; 組裝船 fabricated ship; 組裝生產 assembly ...
  1. Near the gates of foxconn, a huge electronics assembly plant that is one of the city of shenzhen ' s largest employers, a half - dozen former factory workers lounged in the shade on a recent afternoon

    深圳最大就業機會提供者鴻海電子組裝廠的大門口附近，最近一個午後六個工廠離職員工懶洋洋的坐在陰涼處
  2. The ff was 0. 393 and the n was 0. 3 %

    選填充因子最大的tio _ 2薄膜電極組裝了太陽能電池。
  3. Hic has been the important technical channel for realizing the small - scale, multi - functional, high - performance, highly reliable military electric equipment, for hic make good use of high - integration, high - speed and other characters of sic, and formed a new - generation advanced microelectronic assembly technique

    混合集成電路（ hic ）充分利用半導體集成電路（ sic ）高集成度、高速等特點，形成新一代高級的微電子組裝技術，並已成為實現軍用電子裝備小型化、多功能化、高性能化、高可靠性的重要技術途徑。
  4. Microstructures and properties of si - al alloy for

    噴射沉積硅鋁電子封裝材料的組織與性能
  5. Organic - inorganic assembly layered perovskite - type materials integrate useful organic and inorganic characteristics on a molecular level. the inorganic component forms an extended framwork bound by strong covalent or ionic interactions, and the organic component is filled in which and thus the organic layer and inorganic layer are alternately stacked. the materials have unique properties such as electronic, optic and magnetic properties, and there has been great interest in studying them recently

    層狀類鈣鈦礦有機-無機分子組裝材料在分子水平上結合了有機組分和無機組分的有益特性，無機組分通過強的共價鍵或離子鍵形成擴展的骨架，並將有機組分填入框架中形成有機層與無機層交替的結構，具有某些電學、光學、磁學特性，引起人們的研究興趣。
  6. The result show that ppv and c6o ( oh ) n in the ionic self - assembled multilayer films have nothing to do with each other on the ground state, but light arise charge transfer between ppv and c6o ( oh ) n on the excitation state, and the structure of electron donor - accepter is formed in the films

    通過以上結構的確定及各種特性的測試分析，顯示靜電自組裝復合薄膜在基態下ppv和c _ （ 60 ） （ oh ） _ n不發生作用，但在光照激發狀態下會發生分子間電荷轉移，形成給體?受體結構。
  7. Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求
  8. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  9. Dynamic loading plays a critical role in the functional performance and mechanical reliability of microelectronic components and devices

    動力載荷對微電子組件和裝置能否可靠工作起關鍵作用。
  10. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  11. Through the fundamental and applied research activities in this field, the olf - based molecular assembling can be realized, the nanostructured materials with special properties can be obtained, so as to enrich the developing disciplines in 21st century such as olfs - related molecular electronics and nanoelectronocs

    通過該研究的基礎研究和應用研究，可以真正實現基於納米洋蔥狀富勒烯的分子組裝，獲得各種性能優異的納米材料，從而豐富富勒烯類碳籠分子的分子電子學以及納米電子學等這些21世紀的新興學科。
  12. A typical optocoupler made up of two electronic assembles : an ir led and an output optoelectronic detector which are integrated into a dip

    典型的光耦合器是將兩個電子組件-紅外（ ir ）發光二極體（ led ）和輸出光電探測器集合到一個雙列直插式封裝（ dip ）中。
  13. The afm results showed that nanospheres modified pla membranes via electrostatic assembly were obtained successfully. the cytocompatibility test results showed that the gelatin nanospheres and chitosan nanospheres that embedded on the pla membranes could obvious promote the attachment, growth and activity of chondrocytes

    原子力顯微鏡（ afm ）和接觸角測試分析結果說明採用靜電自組裝法可以成功制備得到具有不同表面性質的納米微球改性聚乳酸組織工程材料表面。
  14. Workmanship requirements for soldered electronic assemblies - through - hole mount assemblies

    釬焊電子組件的工藝要求.通孔安裝組件
  15. Workmanship requirements for soldered electronic assemblies - part 3 : through - hole mount assemblies

    釬焊電子組件的工藝要求.第3部分:通孔安裝組件
  16. Since 1998, a total of more than hk $ 140 million was awarded to cuhk, in which hk $ 16. 6 million was appropriated by the information technology fund to set up the ppl, dedicated to the r & d of photonic component packaging and related technologies and processes

    自一九九八年起，中大共獲得超過一億四千萬港元撥款，其中包括創新科技基金一千六百六十萬港元撥款，用作成立光電子封裝實驗室，研究光電子組件的封裝及有關技術。
  17. Abstract : in this article, we discuss the calculation method of the heat analysis in the multilayer rectangular model system when there is heat source in the upper surface of the system. this method can be used in the heat analysis of the design of integrated circuit, micro - electrical assembly unit, etc

    文摘:研究上表面含熱源的多層矩形模型半解析的熱分析計算方法.該計算方法可以用於集成電路、混合電路和微電子組裝件的熱設計工作
  18. The sample techniques of cad cam software applied in electronics assembly

    軟體在電子組裝領域中應用技巧實例
  19. Recently it becomes a hot point to find the defects of the solder joint in time and effectively

    近年來，如何及時有效的發現焊點的缺陷一直是電子組裝行業研究的一個熱點。
  20. Industrial automation systems and integration - product data representation and exchange - application protocol - electronic assembly, interconnection, and packaging design

    工業自動化系統和集成.產品數據表示和信息交流.應用協議.電子組裝互連和包裝設計
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