電沉積銅 的英文怎麼說

中文拼音 [diànchénjītóng]
電沉積銅 英文
acid copper
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 沉 : Ⅰ動詞1 （沉沒; 墜落） sink 2 （沉下 多指抽象事物） keep down; lower 3 [方言] （停止） rest Ⅱ形容...
  • 積 : Ⅰ動詞（積累） amass; store up; accumulate Ⅱ形容詞（長時間積累下來的） long standing; long pending...
  • 銅 : 名詞（金屬元素） copper （cu）
  • 沉積 : [地] deposit; sedimentation; deposition; precipitation
  1. The third ways of making stencil is electroform. hole forming by the way of nickel deposit onto the copper cathode

    製作模板的第三種工藝是電鑄成型。在這個工藝中，鎳沉積在銅質的陰極心上以形成開孔。
  2. In 2005, 61 physical and chemical parameters were measured and analysed in sediments. these included particle size, electrochemical potential as highly anoxic sediment with negative potential is related to organic pollution, chemical oxygen demand which indicates organic pollutants, total sulphide inorganic constituents, source of the unpleasant - smelling gas hydrogen sulphide, 15 metals and metalloids aluminium, arsenic, barium, boron, cadmium, chromium, copper, iron, lead, manganese, mercury, nickel, silver, vanadium and zinc, and trace toxic organics pahs and pcbs - 16 compounds and 18 congeners respectively

    2005年，沉積物監測包括分析61種物理及化學參數，其中有粒子大小電化學勢有機污染促使沉積物缺氧，而讓電化學勢呈負數值化學需氧量顯示有機污染程度總硫化物無機物，是造成難聞氣體硫化氫的主因15種金屬及準金屬鋁砷鋇硼鎘鉻銅鐵鉛錳汞鎳銀釩及鋅和痕量毒性有機物多環芳烴及多氯聯苯分別為16種復合物及18種同質物。
  3. Study on precise cold extrusion technology of 6061 al - alloy splines shell

    電沉積法制備的超細晶薄銅板拉伸及表面層效應
  4. Copper electrodeposition in ulsi

    超大規模集成電路中的電沉積銅
  5. Standard specification for electrodeposited copper for engineering uses

    工程用電沉積鍍銅標準規范
  6. As for cathode of mercury - free alkaline zinc manganese - dioxide battery, mono - layer plating of in, zn, sn and double - layer plating of zn - in, sn - in, zn - sn was electroless deposited on the surface of current collector respectively

    在堿性鋅錳電池負極銅集電體表面用化學方法分別沉積緻密的銦、鋅、錫單層和鋅銦、錫銦、鋅錫雙層。
  7. Corrosion protection of metals - electrodeposited coatings of nickel, nickel plus chromium, copper plus nickel and copper plus nickel plus chromium

    金屬防腐蝕.鎳鎳鉻銅鎳銅鎳鉻電解沉積鍍層
  8. The influence factors to electrochemical deposition and gradient distribution of pmgcf, such as the predrying extent of the swelling cathode film, the excessive power voltage of the cathode, the ph value of electrochemical reduction medium solutionn, the microstrucure of polymer matrix, were majorly invested in this thesis

    本文著重討論了了溶脹陰極膜的預乾燥程度、陰極過電位、電解質溶液的ph值、聚合物基體的結構等因素對金屬銅在溶脹陰極膜中的沉積分佈以及結晶的形態的影響。
  9. On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained

    本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。
  10. The result showed that the interpenetration network structure between polymeric and deposited metal has been observed under a scanning electronic microscope and optical microscope. the experiments showed that copper deposition gradient distribution and crystal structure were greatly influenced by the the ph value of electrochemical reduction medium solution and the size, number and distributing of microporous in swelling cathode film

    用掃描電鏡和體式顯微鏡對制備的pmgcf進行了分析，結果表明：制備的pmgcf樣品的金屬沉積層梯度分佈均勻，在一定的電化學條件下金屬銅和聚合物基體形成了互穿的立體網狀結構。
  11. For the period 2001 - 2005, copper one of the metals commonly used in the pcb and electroplating industries was found in the sediment of all stations in victoria harbour at levels that exceeded the upper chemical exceedance limit

    2001至2005年間，維多利亞港水質管制區沉積物的含銅水平銅為印製電路板及電鍍業常用的金屬之一，均高於化學超標上限，而荃灣附近沉積物的銅銀鉻鎳含量亦高於化學超標上限。
  12. It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance

    結合銅在微電子工業中的應用，綜述了硫酸鹽鍍銅中銅的電沉積機理、銅鍍層微結構、添加劑對銅電沉積過程的影響以及銅電沉積初期行為方面的研究進展。
  13. 5. manganin thin films with low temperature coefficient of resistance were prepared by magnetron sputtering. the changes of tcr under difference deposition and heat treatment conditions were studied

    首次採用磁控濺射法沉積了低電阻溫度系數的錳銅薄膜，研究了在不同電子科技大學博士學位論文沉積及熱處理條件下薄膜tcr的變化。
  14. A review is given on the electrodepositing mechanism of copper from sulfate bath and on the microstructure of the copper coating, the effect of additives on the electroplating process, as well as the research progress concerning copper electrodepositing

    摘要銅的性質決定了銅在工業應用中的重要性，特別是目前在微電子工業中的決定性作用，使銅的電沉積過程成為研究熱點。
  15. Pulsed, filtered cathode arc plasma deposition ( pfcapd ) is a new deposition technology for a range of metals and compounds films free of the microdroplets associated with conventional arc evaporation, and it seems as one of the best methods to deposition hydrogen - free diamond like carbon which has widespread applications for its unique properties

    脈沖磁過濾陰極弧等離子體沉積由於能很好地過濾液滴，沉積幾乎所有金屬及其合金薄膜材料，尤其能沉積極有應用前景的類金剛石膜及用於微電子工業的銅內連材料，日益受到重視。
  16. The analytic results of the effects on the micromorphological structure of the film by the electrochemical condition ' s showed that the carbon is apt to improve the boundary combination between the scfs and the surface of the cathode and the seperation of the films, and that the micromorphological structure of the mpgcfs is greatly affected by the dring and the power voltage, which remarkably affluence ion move in swelling cathode film, and that higher temperature and concentration of cu2 + in the medium solution are also advanagable to the deposition of cu in scfs. the plot of deformation behavior of mpgcfs showed that the maximum strench ratio decreases and the brittleness increases due to the existence of the metal phase, and that the strengh trend of the composite films is fistly up and down followed with the content of metal phase because of the change of the role of the metal phase from acting as the physical cross - linking to weakening the films due to destroying the whole structure of the polymer

    另外它作為基體的另一個突出的優點是制備的溶脹復合膜（ scf ）中的溶劑與電解液中的溶劑相同都是水，克服了以前膜內外不同溶劑之間擴散的問題，結果使得電流最終趨於一種穩態，因此可以更好實現用電化學條件來控制mpgcf的形態結構；硬質石墨材料的多孔的結構和石墨本身的結構性能特點使得碳作為陰極材料時有利於溶漲復合膜（ scf ）與電極表面的結合以及膜的剝離，因此是作為陰極的理想材料；電化學條件中的乾燥程度和電壓能夠明顯的影響離子在膜內的遷移，從而對mpgcf的形態結構造成較大的影響；而提高反應溫度和增大電解液中銅離子的濃度也有利於銅在膜中的沉積生長。
  17. Significant research works have been focused on single metal, in particular copper deposition and its mechanism and kinetics, including electrochemical parameter and physical parameter measurements

    研究了單金屬特別是銅的沉積、形成機理和動力學以及採用的研究方法和分析測試手段，包括對電化學參數和物理參數等研究。
  18. In addition, higher levels of cadmium, chromium, copper and other metals are also typically found in the sediment of typhoon shelters around victoria harbour. this contamination appears to be related to discharges between the 1960s and the 1980s from industries involved in electroplating and in the manufacture of printed circuit boards and electronics goods

    另外，維港避風塘沉積物的鎘鉻銅和其他金屬水平一般較高，這種情況與六十年代至八十年代電鍍廠印製電路板廠和電子廠的污染排放有關。
  19. Experiment of hydrogen evolution showed that the evolution hydrogen amount of current collector coated by mono - layer plating or double - layer plating was less than without them in 7. 0m koh solution with zinc power, and that of the double - layer plating of zn - in, sn - in was the least. cyclic voltammetry - indicated that there is an obvious reduction peak of hydrogen at the potential of about - 0. 8v vs

    用動態析氫實驗表徵，發現沉積單、雙層金屬的集電體在含鋅粉的7 . 0m的氫氧化鉀溶液體系中的析氫量比無沉積層的銅集電體析氫量要小，其中，沉積鋅銦、錫銦雙層的析氫量最小。
  20. Standard specification for electrodeposited coatings of copper plus nickel plus chromium and nickel plus chromium

    銅鎳鉻及鎳鉻的電解沉積鍍層標準規范
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