電路板層 的英文怎麼說

中文拼音 [diànlùbǎncéng]
電路板層 英文
board layer
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  • 層 : i 量詞1 （用於重疊、積累的東西 如樓層、階層、地層） storey; tier; stratum 2 （用於可以分項分步的...
  • 電路板 : accessory board
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Ym series is an epoxy - bond, two - part liquid thermal cure marking ink. it has such perfimance characters as good printing adaptability, fast curing rate excellent adhesion and insulation resistance. it is better to be used in making double surface and the multipke layers circuit boards

    Ym為雙組液型熱固化標記油墨，具有良好的印刷性，固化速度快，塗膜硬化后具有優異的附著力、耐化學性，特別適合用於雙面及多層印刷電路板。
  2. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材
  3. " electronic 1c chip drawing system " provides many functions such as " modify the position of the component ' s diagram " " modify the color of the component ' s diagram " " magnify and minify the component ' s diagram without distortion " " change the type of drawing line " " edit some physical properties of the component " " copy and paste diagram of one component " " delete one or more component diagrams " " move more than one components " positions " " change the z _ order of the diagram, set it to back or bring it to front " " save the drawing of the electronic components to one file and the file extension name is *. brd " " print the drawing ". users can finish all these functions easily by clicking and dragging the mouse

    電路板元器件繪制系統主要完成了使用鼠標拖拽、鼠標點按的方式繪制電路板上各種常見的元器件圖形；編輯電路板上元器件圖形的位置；編輯元器件圖形的顏色；不失真的對器件圖形進行放大和縮小；編輯元器件圖形的線型；編輯電路板上各個器件的物理屬性（比如電阻的阻值大小、電容的容量大小、額定電壓等） ；復制已經繪制出的電路板上的器件；粘貼剪貼板上的器件；刪除單個或多個已經繪制出的器件圖形；同時改變多個器件圖形的位置；改變繪制區內各個元器件的zorder順序，也就是可以將層疊在一起的圖形置前或置后；把繪制的電路板器件圖保存到指定文件中；能打開、查看和修改保存的電路板器件圖；列印電路板器件圖。
  4. This paper first begin with the connotation of virtual instrument technology, study and discuss the criterion and the working theory of usb deeply. on the principle of usb1. 1criterion, using usb interface chip usbn9604 and low consumption mirochip c8051f231, we designed the available interface of usb bus and its controlling software, turn the communicating function based usb bus between computer and testing device. second based on the developed interface of usb bus, using microchip pic16c62 and a mount of relays, we designed the multiswitching scanner and its controlling software to complete the funtion of accesses swithing in testing system. third calling the api function inside the windows using vb programming language, communicat with the impelling program of selected hid, achieve the function of testing instrument with usb interface, complete the development of upside software faced testing. at last, based on the deep studying of pcb testing method, used the developed multiswithing scanner and software faced testing, combinated with necessary testing instrument, we constructed the pcb testing system and analized the testing result simply

    論文首先從虛擬儀器的技術內涵出發，深入研究和討論了通用串列總線usb規范及工作原理，並依據usb1 . 1規范，採用usb介面晶元usbn9604和低功耗微處理器c8051f231設計開發了通用的usb總線介面及其控制固件，實現了通用計算機與測試設備之間基於usb總線的通信功能；其次，在所開發的usb總線介面的基礎上，使用微處理器pic16c62和多路繼電器開關，設計開發出實現測試系統中測試通道切換功能的多路通道掃描器及其控制固件；再次，採用vb語言編程，調用windows內部api函數，與選定hid類驅動程序進行通信，實現usb總線介面測試儀器功能，完成面向測試的上層軟體開發；最後，在深入研究印刷電路板測試方法的基礎上，利用已開發的多路通道掃描器和面向測試軟體，結合必要測試儀器組建印刷電路板測試系統，並對測試結果進行了簡要的誤差分析。
  5. Direct connect vias conduct so much heat away from the pin and into the plane that high temperature or long soldering time may be required to complete the joint - thermal damage could occur to both the board and the component from soldering or desoldering

    在焊接時，直接連接的過孔會通過引腳把大量的熱傳導至內電層，因此完成焊接就需要很高的溫度或者延長焊接時間，這就會導致在焊接或拆焊時發生電路板或元件的損壞。
  6. Our main product included single sided, two - sided and 1 ~ 5 layers fpc, as well as rigid - flexible printed circuit board and rigidity superconductive board. we also produce traditional printed circuit board ( pcb )

    主要產品為單面、雙面、 1 ~ 5層撓性電路板，剛-撓性結合板以及剛性超導板等。本廠同時也生產傳統的pcb 。
  7. Bulid - up flexible printed board

    表面層合電路板
  8. Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification

    印製電路板.層間連接剛性印製電路板.分規范
  9. Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification

    印製電路板.第4部分:有扁導線的硬質多層印製電路板分規范
  10. Printed boards. part 4 : rigid multilayer printed boards with interlayer connections. sectional specification

    印刷電路板.第4部分:層間連接件的剛性多層印刷電路板.分規范
  11. Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997

    印製電路板.第4部分:層間連接剛性多層印製電路板.分
  12. Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels, a, b and c

    印製電路板.層間連接剛性印製電路板.分規范.性能詳細規格. a ， b和c級性能水平
  13. Printed boards. part 4 : rigid multilayer printed boards with interlayer connections. sectional specification. section 1 : capability detail specification performance levels a, b and c

    印刷電路板.第4部分:層間連接件的剛性多層印刷電路板.第1節:容量詳細規范性能等級a b和c
  14. Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a, b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997

    印製電路板.第4部分:層間連接剛性多層印製電路板.分
  15. Surface laminar circuit sl

    表面層合電路板
  16. Surface laminar circuit

    表面層合電路板
  17. Sectional specification - flexible multilayer printed boards with through connection ; german version en 123800 : 1996

    分規范.帶貫通連接的撓性多層印製電路板
  18. Sectional specification - flex - rigid multilayer printed boards with through connections ; german version en 123600 : 1996

    分規范.帶貫通連接的彎曲剛性多層印製電路板
  19. Applied for the floor which is required to resist corrosion from acid or alkali, for the ground or covering layer of cement floor, drainage pool or alkali pool of circulation boards workshop or place where strength reinforcing floor is needed, or for the surface layer or ground layer or isolation layer of epoxy mortar

    要求耐酸堿化學溶劑腐蝕的地面，電路板車間或加強抗拉力的水泥地面、排水溝及堿水池的面層，環氧砂漿面層與塊材面層，地面和隔離層。
  20. Due to the various kinds of the instruments and some commerce reasons, few instrument manufactories can provide whole principle chart of the instrument, and the key technology is kept secret too. so it is almost very difficult to realize fault diagnosis on them from the level circuit board

    由於儀器儀表的種類比較繁多，外加一些商業原因，國內外的儀器設備製造廠商很難提供完整的設備原理圖，對于其中的關鍵技術也是保密的，所以很多時候很難從電路板級的層次來進行故障診斷。
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