電鍍銅法 的英文怎麼說

中文拼音 [diàndùtóngfǎ]
電鍍銅法 英文
electrocoppering
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 鍍 : 動詞（用電解或其他化學方法使一種金屬附著到別的金屬或物體表面上） plate
  • 銅 : 名詞（金屬元素） copper （cu）
  • 法 : Ⅰ名詞1 （由國家制定或認可的行為規則的總稱） law 2 （方法; 方式） way; method; mode; means 3 （標...
  • 電鍍 : electroplate; electroplating; electrofacing; （electric） plating; electrocladding; galvanize; ga...
  1. Taps on the main series of products using high - quality copper material, in italy advanced gravity casting process, fine grinding and polishing as from the surface using seven storeys space electroplating chromium plating method, the leading luster as people

    主要採用優質銅材料，在義大利先進重力鑄造工藝下，經精細打磨拋光而成，表面採用七層太空電鍍法鍍鉻，使龍頭光採照人。
  2. Conductive poly ( ethylene terephthalate ) ( pet ) fabrics were prepared by electroless copper and nickel plating

    摘要採用化學鍍的方法制備鍍銅和鎳導電滌綸織物。
  3. Because of the limitation of experimental conditions we failed to form foam lead grid in the experiment. copper draw net is used as anode grid and it can improve to some extent the utilization of pam. due to human errors in the experiment we have not used the same discharge current density

    在實驗中我們試圖通過鑄造法、電鍍法和還原法等一系列的實驗辦法製作泡沫鉛板柵，由於實驗條件的限制，沒能夠成功制得泡沫鉛，而在使用銅拉網作為正極板柵的時候，能夠使電池的正極活性物質利用率有提高，但由於實驗時候的失誤，沒能夠使用相同的放電電流密度進行放電，我們無法利用實驗數據比較出具體能提高的數字。
  4. The pretreatment, effect of bath compositions and operation conditions such as temperature, currenty and time on compactness of the zinc and cu / ni / cr coatings have been investigated. the relationship of operation conditions to thickness of the coatings was studied by weight method. the specimens have been pickled in nacl or sulfate acid solution to evaluate the porosity of the coating

    研究了鎂合金電鍍前處理工藝，電鍍鋅、電鍍銅/鎳/鉻工藝配方及其施鍍溫度、電流密度和時間對鍍層緻密性的影響;採用稱重法研究施鍍工藝與鍍層厚度的關系，利用nacl溶液和硫酸溶液浸泡試樣來考察鍍層孔隙率，採用劃痕試驗和熱震試驗檢驗鍍層的結合力，採用金相顯微鏡和掃描電子顯微鏡觀察鍍層表面形貌。
  5. The good adhesion of zinc coating can be obtained. 3. pyrophosphate copper electroplating is conducted by ammonium citrate as a auxiliary complexing agent at around 40, the narrow range of current density can

    3 .焦磷酸鹽鍍銅時採用檸檬酸銨作為輔助配合劑，溫度控制在40左右，電流密度范圍較窄，控制在1 . 0a . dm ~ （ - 2 ）左右，電鍍時間較長，無法達到無孔狀態，所以必須採用酸性鍍銅加厚銅鍍層。
  6. Methods for analysis of acid plating copper solutions part 6 : determination of arsenic content by spectrophotometric method

    酸性電鍍銅溶液分析方法第6部分:分光光度法測定砷的含量
  7. Methods for analysis of acid plating copper solutions part 1 : determination of copper sulfate content by edta volumetric method

    酸性電鍍銅溶液分析方法第1部分: edta容量法測定硫酸銅的含量
  8. Methods for analysis of acid plating tin solutions - part 4 : determination of copper content by atomic absorption spectrometric method

    酸性電鍍錫溶液分析方法第4部分:原子吸收光譜法測定銅的含量
  9. The process of copper metallizing of carbon powder was investigated. the hydrophilicity, sensitization, activation and reduction were also studied. the copper deposit could be made thicker by electromagnetic agitation

    摘要研究了在碳粉表面電鍍銅的工藝。首先對碳粉表面進行親水、敏化、活化和還原處理，然後在其表面化學鍍銅，形成導電膜，再採用電磁攪拌的方法電鍍銅，使鍍層加厚。
  10. Methods for analysis of cyaniding plating brass solutions - part 1 : continual determination of copper cyanate and zinc oxide content by edta volumetric method

    氰化電鍍黃銅溶液分析方法第1部分: edta容量法連續測定氰化亞銅和氧化鋅的含量
  11. Methods for analysis of cyaniding plating brass solutions - part 2 : determination of free sodium cyanate content by potentiometric titrimetric method

    氰化電鍍黃銅溶液分析方法第2部分:電位滴定法測定氰化鈉
  12. Methods for analysis of cyaniding plating brass solutions - part 3 : determination of sodium carbonate content by potentiometric titrimetric method

    氰化電鍍黃銅溶液分析方法第3部分:電位滴定法測定碳酸鈉的含量
  13. Methods for analysis of acid plating copper solutions part 5 : determination of nickel sulfate content by atomic absorption spectrometric method

    酸性電鍍銅溶液分析方法第5部分:原子吸收光譜法測定硫酸鎳的含量
  14. Determination of impurity cu and fe in electroplating solution by faas

    火焰原子吸收法直接測定電鍍液中銅和鐵離子
  15. Methods for analysis of acid plating copper solutions part 4 : determination of iron content by atomic absorption spectrometric method

    酸性電鍍銅溶液分析方法第4部分:原子吸收光譜法測定鐵的含量
  16. Methods for analysis of acid plating copper solutions part 7 : determination of antimony content by atomic absorption spectrmetric method

    酸性電鍍銅溶液分析方法第7部分:原子吸收光譜法測定銻的含量
  17. Methods for analysis of acid plating copper solutions part 3 : determination of sulphuric acid content by potentiometric titrimetric method

    酸性電鍍銅溶液分析方法第3部分:電位滴定法測定硫酸的含量
  18. Methods for analysis of acid plating copper solutions part 2 : determination of copper sulfate content by potentiometric titrimetric method

    酸性電鍍銅溶液分析方法第2部分:電位滴定法測定硫酸銅的含量
  19. Finally, aimed at laminated object manufacturing ( lom ) machine which is widely applied in domestic market, a new technique for covering lom prototype with special coating spraying is put forward, the problem on metallization of lom prototype is resolved by means of rapid electroless plating copper, a rapid edm electrode fabrication technology based on lom is established

    最後，針對目前國內市場應用較普遍的分層實體製造（ lom ）快速成型設備，提出了基於特殊塗料噴塗法的lom紙質原型封閉處理新技術，通過快速化學鍍銅解決了lom紙質原型導電化的難題，建立了基於lom紙質原型快速製造電加工電極的工藝。
  20. Coating metal such as cu, ni, ti, mo, w or compound coating on diamond grain ( dg ) surface by coating ( chemical, electronic plating ) and vacuum plating method ( evaporating, sputtering, ionization ) was studied

    摘要採用濕法鍍（化學鍍、電鍍）或真空鍍（蒸發鍍、濺射鍍、離子鍍）方法，在金剛石表面鍍覆一層銅、鎳、鈦、鉬、鎢等金屬，或者它們的復合鍍層。
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