align feature 中文意思是什麼
align feature
解釋
線狀地物-
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機( flipchipbonder )是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備,適合於特徵尺寸小,鍵合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大規模生產。 -
Snap to alignment feature helps you align objects precisely
對齊這種功能可幫助您精確對齊對象。 -
You can also use this feature to wrap text around images and to align objects with one another
也可以利用該功能使文本環繞圖片,以及將對象對齊。
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