alloy solder 中文意思是什麼

alloy solder 解釋
合金焊料
  • alloy : n 1 合金。2 （合金中的）劣等金屬。3 （金銀的）成色，成份。4 〈比喻〉攙雜品。vt 1 合鑄，熔合（金屬...
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  1. Alloy silver solder

    銀合金焊
  2. Electrodeposited coatings of tin - lead alloy solder plate

    錫鉛合金的電解沉積鍍層
  3. Cast copper alloy solder joint drainage fittings - dwv

    Dwv鑄銅合金釬焊連接排水配件
  4. Cast copper alloy solder joint drainage fittings : dwv

    Dwv類鑄銅合金釬焊連接排水管件
  5. Cast copper alloy solder joint pressure fittings

    鑄銅合金軟釬焊連接壓力管件
  6. Wrought copper and copper alloy solder joint pressure fittings

    鍛銅和銅合金釬焊壓力配件
  7. Wrought copper and copper alloy solder - joint pressure fittings

    鍛銅和銅合金釬焊接壓力連接件
  8. Cast copper alloy solder joint drainage fittings - dwv ; errata

    鑄銅合金軟釬焊連接排水管件. dwv .勘誤
  9. Wrought copper and wrought copper alloy solder joint drainage fittings - dwv

    Dwv型鍛銅和鍛銅合金釬焊排水配件
  10. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。
  11. Spherical alloy solder powder producing by high - energy atomizing technique, under accurate monitoring by the computer, carrying out the high quality standard of the alloy solder powder, can satisfy with the high quality demand of the solder paste manufacture absolutely

    採用高能霧化技術生產的球型合金焊錫粉，在計算機精確的控制下，執行高品質的合金焊粉質量標準，完全能滿足高品質錫膏製造的要求。
  12. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中，前四項對焊點可靠性比較重要，焊接環境對焊點可靠性的影響不很顯著。
  13. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  14. Then the paper also study the atomizer structure ( the protrusion of the delivery tube value h ), atomizing gas pressure p, over - heat temperature of alloy a t, the component of solder alloy and atomizing medium and so on

    進一步對霧化器結構（導液管突出高度h ） 、霧化氣體壓力p 、合金過熱度t 、焊錫合金成份和霧化介質進行了研究。
  15. Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux

    下列因素是必須被考慮的：包括合金的類型、焊錫粉的粒徑大小以及助焊劑的類型。
  16. An introduction to eutectic au sn solder alloy and its preforms in microelectronics optoelectronic packaging applications

    金錫焊料及其在電子器件封裝領域中的應用
  17. We have developed a set of supersonic atomizing equipment with the base theory of the supersonic atomization and the base characteristic of the solder alloy. the paper studies systematic the production technology and process of the solder alloy fine powders in the equipment, and deduces the gas velocity formula used in supersonic atomization in theory

    為此，運用超音速霧化的基本原理和焊錫合金的基本性質，研製出一套超音速霧化裝置，在該裝置上對焊錫合金微粉的制備技術及工藝進行了系統的研究，並從理論上推導出適用於超音速霧化的氣體速度公式。
  18. A study on the multiaxial time - dependent constitutive model with nonproportionality of 96. 5sn - 3. 5ag solder alloy

    釬料合金的含非比例度的多軸時相關本構模型研究
  19. The manufacturability and reliability problems involved during the lead - free transfer process and transition stage were discussed, including its influence on the components / devices, pcb and solder alloy and the compatibility problems

    摘要闡述了在無鉛轉移過程中涉及的可製造性與可靠性問題，包括無鉛轉移對元器件、印製電路板與焊點的影響以及它們相互之間的兼容問題。
  20. The fine powders of the solder alloy are one of the key materials in the smt, the requirement as following : the particle diameter is in 5 u m ~ 74 u m, the shape is spherical and the distribution of the particle size is uniform

    表面組裝技術（ smt ）已廣泛應用於電子工業中，而焊錫合金微粉是該技術的關鍵材料之一，通常要求：粉末粒徑5 74 m ，形狀為球形，且粒徑分佈均勻。
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