ball bonding 中文意思是什麼

ball bonding 解釋
球焊
  • ball : n 鮑爾〈姓氏〉。n 1 球；球狀物。2 球戲，（特指）棒球；【棒球】壞球 （opp strike） 3 【軍事】子彈...
  • bonding : 冰凍膠結
  1. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  2. Trough the experiment, we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )

    通過實驗，探索出了合適的貼裝方式（ 183焊膏貼裝）和管芯鍵合工藝（直徑18 m的金絲球焊） 。
  3. Figure 6 : drawing3 showing wedge bonding operation on the second bond, at the substrate bondinger. figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is onthe die side )

    月牙形焊接（熱超聲焊的末端）的尺寸和形狀直接與引線直徑和毛細管的幾何形狀有關。
  4. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  5. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
  6. The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed, and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process, separately

    本文首先對比分析了銅絲球鍵合和金絲球鍵合的全過程，採用實驗設計分別對燒球工藝參數和鍵合工藝參數進行了優化。在此優化參數下，獲得了連接良好的銅絲球鍵合點和金絲球鍵合點。
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