bga 中文意思是什麼
bga
解釋
南北橋-
Unique a 3 segments ' temperature curve program achieves a steady heat rising and good protection of bga component
獨設三段式溫度曲線程序,實踐分段升溫控制,令bga得到妥貼的保護。 -
Overall design of soldering and smd / bga desoldering function
全面性維修設計,包括焊接及smd / bga拆焊雙功能。 -
Unique joint start function with 852d + desoldering station and 863e preheater has same step heating to protect pcb and bga
獨設聯機開啟功能, 852d +拆焊機與863e預熱臺同步發熱,保護pcb及bga 。 -
Bga test technology amp; amp; quality control
焊點的質量控制 -
Hombitan locr - k fulfils the requirements of the german federal health authority ' s ( bga ) recommendation ix for material, as well as all other national purity standards, so that its use in food packaging articles is not restricted
滿足德國聯邦健康組織( bga )的要求,做為對原料規定要求,符合所有其它國家純度標準,因此它在食品包裝業中的應用是不受限制。 -
Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn
環境和耐用試驗.區域陣列式包裝件表面安裝板的試驗方法fbga bga flga lga son和qfn -
Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn iec 62137 : 2004 corrigendum : 2005 ; german version en 62137 : 2004
環境和耐久性試驗.區域陣列式包裝件表面安裝板的試驗 -
Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本論文正是針對以上情況,以採用引線鍵合工藝的三維疊層csp / bga封裝(裸晶元疊裝)為研究對象,在有限元分析軟體ansys中建立相關的有限元模型,編制了相應的apdl參數化分析程序,進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。 -
However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充膠樣品粗化尤為嚴重; ? ni - sn金屬間化合物包括兩層:其中,靠近ni焊盤的那層比較平整,同時, eds結果分析表明其化學式近似為nisn ,而靠近焊料的那層呈板條狀,化學式近似為nisn _ 3 ,文獻表明其為亞穩相; ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用,同時,器件失效模式變為晶元粘接層分層; ? c - sam結果表明本論文採用的充膠樣品,晶元粘接層分層起始於500周左右,而經過2700周循環的樣品,分層幾乎擴展到整個界面。 -
At present, bga / csp is becoming the mainstream of the advanced ic package technology
目前微電子球柵陣列尺寸封裝( bga csp )正成為高端ic封裝的主流技術。 -
Bga ball grid array
球狀網陣排列 -
Vacuum pen device is used to lift up and place bga from / on mainboard to meet bga non - touch nature
真空吸放筆裝置,實現零作用力吸放功能,符合bga免觸的特性,無損拆焊的組件。 -
Unique built - in sucker is used to lift up and place bga from / on mainboard to meet bga non - touch nature
獨有內置真空吸盤裝置,實現零作用力吸放功能,符合bga免觸的特性,無損拆焊的組件。 -
Recently, designers developed a new type of package : ball grid array ( bga ) package. the bga package has many i / o pins. because of this merit, this kind of package is used widely now. but the package has a new structrue, and the old routing algorithms are not used
鑒于球柵陣列封裝( bga )的優點,這種技術成為目前最廣泛的封裝形式。然而由於球柵陣列封裝( bga )結構的特殊性,對于這種封裝上的布線演算法不同於普通的布線演算法。 -
Bga transform and insulating substrate technology
焊球陣列轉變與絕緣基板技術 -
Established international trading company handling smt machineries like aoi, 3d solder paste inspector, screen printers, reflow ovens, wave soldering machines, x - ray, bga rework stations and thermal profilers. requires experience smt sales executives for north and south china market
上海地艾星國際貿易公司是專門從事smt設備進出口的國際貿易公司,並提供完善的技術支持和售後服務.主要設備包括光學檢查機, 3d焊錫膏檢查系統,絲網印刷機,迴流爐,波峰焊, x光檢查機, bga返修臺以及測溫儀。 -
Bga enters mainstream of the contemporary assembly technology
技術成為現代組裝技術的主流 -
Based on the idea of machine ' s load balance, the balance genetic algorithm ( bga ) for amsf is presented
基於機床負荷平衡的思想,提出了面向先進製造車間的平衡遺傳演算法,並與傳統的遺傳調度演算法進行了對比。 -
Fc - bga flip - chip ball grid array
反轉晶元球形柵格陣列 -
The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
為實現更高的功率密度,本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中,完成了一個半橋fc - ipem ( flipchip - integratedpowerelectronicsmodule )模塊。
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