bonder 中文意思是什麼

bonder 解釋
邦德爾
  1. Then, i summarize the superiority of the convertible bonder and the primary rights of bondholders

    通過分析總結出了可轉可轉換公司債券的優越性，概括了可
  2. Specifications for fully automatic gold wire ball bonder

    全自動金絲球焊接機技術條件
  3. In this thesis, the work on automatic alignment system is as follows : firstly, after the methods and optical systems for alignment whose are used commonly now are discussed, a new die leveling method based on auto - focus is presented for the flip chip bonder. auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations

    本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上，針對貼片機實際應用環境，提出基於多點自動對焦的晶元調平方法。
  4. An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders

    全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。
  5. Hcs9000b single zone hot bonder

    Hcs9000b單區熱補儀
  6. Relationship between the quality of rural population and peasants ' income in shaan - gan - ning bonder area

    陜甘寧老區農村人口素質與農民經濟收入關系分析
  7. Technical specification for application of anchor, pincerand and bonder used for prestressing steel bar

    預應力筋用錨具夾具和連接器應用技術規程
  8. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  9. On the basis of researching pid control and its self - tuning methods, fuzzy self - adaptive pid control methods, the transplantation and software development of embedded real - time operation system and other aspects, a temperature control system is designed and tested for the die bonder

    本文在研究pid控制及其自整定方法、模糊自適應pid控制方法、嵌入式實時操作系統c os -的移植和軟體開發等方面的基礎上，設計了粘片機的溫控系統。
  10. This product design for ic assembly die attache process on die bonder machine

    本產品為ic集成電路封裝工藝晶元全自動固晶機上而專門設計。
  11. Under the direction of such theories, the influence of the composition of the concrete to the workability, mechanical property and durability of hplc is analyzed systematically ; the key technology of the preparation of hplc was grasped. the theory of strength improvement of subsidiary bonder is detected, special additive - fdl for hplc is made, lc40 - lc60 hplc with the slump over 18cm, the slump flow over 50cm, segregation degree below 5 %, small drying shrinkage, high tension strength and long durability is prepared. the concept and experimental method of the segregation degree of the mixture is put out and the analytical system of high performance hplc is built

    以設計理念和設計理論為指導，系統研究了輕集料、輔助膠凝材料等組分及其配比參數對輕集料混凝土工作性能、力學性能和耐久性能的影響規律，探明了輔助膠凝材料對于輕集料混凝土的增強機理，研製出能夠有效控制輕集料混凝土拌和物分層離析度和降低坍落度經時損失的專用外加劑fdl ，掌握了制備高性能輕集料混凝土的關鍵技術，制備出坍落度大於18cm 、擴展度大於50cm 、分層度小於5 、低干縮、高韌性、高耐久的lc40 lc60高性能輕集料混凝土。
  12. Outer lead bonder

    外界腳端接合機
  13. Inner lead bonder

    內部引線接合機
  14. Nail head bonder

    釘頭式接合機
  15. The xrd results reveal that the oxides coated are non - crystal and xps results reveal that it has chemical bonder with the surface of graphite particle

    Xrd分析顯示包覆物以無定型態存在， xps分析表明石墨表面與包覆物產生了化學結合。
  16. Design and realization of machine vision system in thermosonic flip - chip bonder

    熱超聲倒裝鍵合機視覺系統的設計與實現
  17. In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra - fine - pitch wire bonding

    目前除了需要不斷提高鍵合機硬體性能外，開發滿足超細間距引線鍵合要求且性能穩定的鍵合工藝十分必要。
  18. For example, some one “ 搞 笑 ” that, although the three gorges dam and the tunnel of english channel have been constructed, there are four projects haven ' t been completed, facing the great wall with tiles, fixing with an air conditioner for the sun, edging with a bonder of gold for the equator and setting rails for the huanghe river

    比如有人搞笑道：盡管三峽大壩造好了，英吉利海峽通隧道了，但世界上還有四大工程沒完成，他們是：給長城貼瓷磚，給太陽裝空調，給赤道鑲金邊，給黃河安欄桿
  19. This product design for ic assembly die bonding process on die bonder machine

    本產品是為ic封裝自動貼片機及其貼片工藝而設計。
  20. " certainly, narcissa, i shall make the unbreakable vow, " he said quietly. " perhaps your sister will consent to be our bonder.

    「當然，納西莎，我會立下牢不可破誓言。 」他輕聲說， 「也許你姐姐願意幫我們做見證人。 」
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