bumping technology 中文意思是什麼

bumping technology 解釋
隆起焊盤形成技術
  • bumping : 暴沸,進沸
  • technology : n. 1. 技術,工程,工藝。2. 製造學,工藝學。3. 術語(匯編)。
  1. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  2. Wafer bumping technology for wlp

    圓片級封裝的凸點製作技術
  3. The paper is based on the project of national natural science foundation " the intelligent control system of ship on bumping and avoiding bumping " and " the study based on the impulsion response of light duty configuration, control and experiment method of high speed ship ". the fuzzy adaptive control is applied to ship steering. it is significant to improve automation technology of ship in china

    本論文以國家自然科學基金項目「船舶碰撞與避碰的運動機理及計算機智能模擬系統研究」和「基於高速船輕型結構流體沖擊響應、控制與實驗方法研究」為依託,將模糊自適應控制應用於船舶的航向控制,這些研究將對我國船舶自動化水平的提高具有較大現實意義。
  4. Tiruchengode, india ? as its technology companies soar to the outsourcing skies, india is bumping up against an improbable challenge

    (印度,泰米爾納德日報)由於印度的技術公司外部采辦的范圍的劇增,它正面臨著一個不可能的挑戰。
  5. For a wafer bumping stencil, the cutting technology must be capable of producing thousands of small, closely spaced apertures to extremely tight dimensional and positional tolerances

    對于晶片凸起鋼網,切割技術應能夠生產尺寸和位置要求極其嚴的好幾千小而密的孔。
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