chemical-mechanical polish 中文意思是什麼

chemical-mechanical polish 解釋
化學壞拋光法一種去掉圓片表面某種物質的方法
  • chemical : adj 化學的,化學作用的;應用化學的,用化學方法獲得的。n 〈常 pl 〉化學製品;藥品。 fine chemicals...
  • mechanical : adj 1 機械的;機械制的。2 機械學的,力學的;物理上的(opp chemical)。3 機工的,技工的;自動的;...
  • polish : adj n 波蘭(人)的;波蘭語(的)。vt 1 磨光,擦亮,拋光。2 使簡練,使醇化,使優美;推敲;潤飾(文...
  1. Chemical - mechanical polish ( cmp ) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. it is used during the fabrication process

    化學-機械拋光( cmp ) -平圓晶光拋和整片的工藝,採用化學移除和機械拋。式方種兩光此工藝在前道工藝中使用。
  2. Thin - film area : the area to deposit " dielectric layer " and " metal layer " as the conducted or insulated films, also has cmp ( chemical - mechanical _ polish ) to planarize the chips on the wafer ' s surface and add high ( low ) temprature rtp ( rapid - thermal - process ) to the wafer

    薄膜區:專門沉積「介電層」 , 「金屬層」等導電或不導電薄膜的區域,併兼做晶圓表面器件之平坦化及高(低)溫快速熱退火製程。
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