chip materials 中文意思是什麼
chip materials
解釋
晶片材料-
The chip of microbridge structure thermocouple type microwave power sensor is designed by using seeback domino offect of thermocouple. ta2n of relatively low resistor - temperature coefficient and si of relatively high thermoelectric power seebeck coefficient are used as thermocouple materials in the chip
微梁結構熱偶微波功率傳感器晶元就是利用熱偶的塞貝克效應設計的，晶元選擇具有低電阻溫度系數的ta2n和具有高熱電系數的半導體單晶si作為熱偶材料。 -
Sub - micron grades with extremely high wear resistance for abrasive materials such as laminated chip board, hard wood, etc
是適合於研磨料（比如電木板、硬木）的加工，具有極高的耐磨性，晶粒度為亞微米級的牌號。 -
Product this getting wet pouch active mt of packaging completely, main raw materials active mt one natural having special crystallization layers of silicate clay ore of form scarce, sublimated and processed and succeeded by special technology, one layer of forms tetrahedron and octahedra chip of it are arranged into six mao net, cause the crystalline grain to expand after absorbing water, pick up the moisture, get rid of oxygen, keeps fresh, anticorro sion, long result function, it is a kind of healthy green environmentally safe product
本品是透濕性小袋包裝的活性mt ，主要原料活性mt是一種天然稀有的具特殊結晶層狀的硅酸鹽粘土礦，經特殊技術提純加工而成，它的層狀四面體和八面體晶片排成六角網格，吸水后引起晶格膨脹，具吸濕、除氧、保鮮、防蝕、長效功能，是一種健康綠色環保產品。 -
The hook tooth with a positive rake angle can be used for all kinds of steel, especially for long - chip and hard - to - cut materials, for example construction steel and hardened steel, as well as high alloy materials
帶有正前角的鉤形齒能用於所有種類的鋼材，尤其適用於長片和難以鋸切的材料，例如結構鋼、粹火鋼以及高合金材料。 -
This article describes a way of special ultrasonic system which monitors thermal stress in seamless welded rails. this monitoring system is a non destructive testing system, which adopts avr mcu and high - precise time chip processing as the core of it, and adopts the critically refracted longitudinal wave as the object of measuring. my studying focuses on the theory of the monitoring system, which will be listed in this arctile : according to the snell theory, the theory of motivating of critically refracted longitudinal wave is described in details, and the finite element software is used to emulate the propagating course. the formulas of calculating the pts of swr are taken from the acoustoelasticity theory, and the calculating the parameters is introduced. according to assemble materials, three kinds of ways of monitoring the pts of swr using critically refracted longitudinal wave are described, which are measuring the sound - time in changeless distance, ultrasonic critical - angle refractomery and frequency spectrum, the first way of ways is used in this experiment system. the factors, which effect the monitoring system, are assaid in some degree based
本文的研究工作重點在無縫焊接鋼軌溫度應力測量系統的理論模塊，包括根據snell原理，研究極限折射縱波的激發機理，並使用有限元軟體ansys進行模擬;根據聲彈性理論以及公式推導出計算無縫焊接鋼軌中的溫度應力的公式，並對其中參數的求解方法進行介紹;根據收集的資料，介紹了三種使用極限折射縱波測量無縫焊接鋼軌溫度應力的方法，即固定距離測量聲時法、臨界角折射法和頻譜分析法，本實驗系統使用的是第一種;根據實驗經驗以及相關資料，分析了影響極限折射縱波測量溫度應力的幾個因素，並提出了相應的解決方法;根據實驗系統的需要，獨立設計並加工出相關配套的實驗設備，包括實驗鋼塊、有機玻璃楔塊、固定件、載荷外框裝置等。 -
Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。 -
As the results, more and more serious requirements were raised to the nuclear data acquisition and control system. in order to meet these requirements and to support the advanced study of the interaction between clusters and materials, a key project supported by china national science foundation, we have done the study of the data acquisition and control system for the clusters characteristic in detail, and employed single - chip microcomputers and pc computers to compose a large scale data acquisition and control system. the composition mode of this kind of system and the distribution of tasks, the acquisition and control circuit units based on single - chip microcomputers, the real - time communication methods and the software composition under the windows 98 were also discussed in detail
針對這一問題並為了保證國家自然科學基金重點項目「荷能離子團簇與介質的相互作用」等前沿研究課題的進行，本論文對團簇研究中的數據獲取和調控問題進行了詳細研究，提出了以pc微機和集群式單片微機為主構成的團簇特性研究用分散式多通道數據獲取和調控系統的方法；詳細討論了這種系統的最佳組成模式、任務分配、單片微機數據采控單元、系統內實時通訊網的建立和windows環境下系統軟體的編寫等硬軟體問題。 -
The resonant characteristics are analyzed using elastic mechanics theory. using fea method, the model of the resonant component is built up and the effects of different beam materials and chip structures on the performance of the chip are studied
從彈性力學角度對傳感器的特性進行了理論分析；並用有限元方法，建立計算機模型，分析了不同材料、結構對梁的振動和敏感特性的影響。 -
In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows
論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。 -
Ih ped one, a nove1 mo1ecuar probe onolecuar beason ( mb ) was developed to establish a stwle and precise method for the quanitative analysis of gentic materials such as ing1 inrn from differen cells and rna fonn tobacco mosaic virus. the milization method for mb was studied for the fabrication of dna biosensor and dna chip. ih pall two, a series of inunobilization method such as sol - gel method and ligh polererization method were investigaed for the otilization of bio - molecues and fluorescence dye
本論文各章內容可歸納如下：第一章，根據抑癌基因ing1基因的序列設計併合成了檢測ing1轉錄產物的分子信標（ 5 ' - - tamra - c6 - nh - cgttgatggttccacttctcgtgcgttcaacg - dabcyl - 3 ' ） ，其中tamra代表四甲基羅丹明，為熒光基團， dabcyl代表4 - （對二甲氨基偶氮苯）苯甲酸，為熒光熄滅基團。 -
Applicability of hard cutting materials for machining by chip removal - information additional to iso 513 designation
機加排屑用硬削切材料應用. iso 513標識的信息補充 -
Application of hard cutting materials for machining by chip removal - designation of the main groups of chip removal and groups of application
切屑形式大組和用途小組的分類代號 -
Preparation and screening of a magnetooptic materials chip composing six elements
六元磁光材料晶元的制備與檢測 -
Workshops will also be set up to enable participants to create their own souvenirs using natural materials from mai po such as wood chip and reed, providing a window into wwfs tree management work in the reserve. microscopes and equipment set in the checkpoint will also give participants a chance to take a closer look at plankton and insect life, and explore the feeding behaviour of different bird species. this event provides a great outdoor experience amid the natural beauty of the mai po nature reserve
特設有趣自然工作坊，讓參加者可以利用如木片和蘆葦等天然資源自製紀念品，以了解米埔的樹木管理工作此外，參加者更有機會使用顯微鏡觀看米埔基圍內的水中微生物與小昆蟲及利用不同工具模仿各種雀鳥啄食習性，從而加深對淡水濕地生態的了解。 -
Research and development of multilayer chip inductors and materials
多層片式電感及其材料的研究與發展
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