clad sheet 中文意思是什麼

clad sheet 解釋
包覆層
  • clad : adj. 1. 穿衣的。2. 被覆蓋的。3. 鍍過（另一種）金屬的；用金屬包被的。vt. （clad; cladding） 在（金屬）外麵包上另一種金屬。
  • sheet : n 1 〈常 pl 〉被單；褥單。2 裹屍布。3 （懺悔者穿的）白衣；懺悔服。4 一張（紙）；紙張；（尤指黃色...
  1. Bismaleimide specifications - specification no. 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范.製造多層印製板用的規定可燃性能的薄比斯瑪勒米德
  2. Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德
  3. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材
  4. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板
  5. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  6. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  7. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  8. Specification for corrosion - resisting chromium steel - clad plate, sheet, and strip

    耐腐蝕鉻鋼復合鋼板薄板及帶材規范
  9. Specification for stainless chromium - nickel steel - clad plate, sheet, and strip

    不銹鉻鎳鋼復合鋼板薄板及帶材規范
  10. Polyimide woven glass fabric copper - clad laminated sheet of defined flammability for printed circuits

    印製電路用限定燃燒性的覆銅箔聚酰亞胺玻璃布層壓板
  11. Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

    限定燃燒性的薄覆銅箔環氧玻璃布層壓板
  12. Thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    多層印製電路用限定燃燒性的薄覆銅箔聚酰亞胺玻璃布層壓板
  13. Our company is a large joint venture company, mainly produce electrolytic copper foil and copper clad laminated sheet. it has got iso9002, ul, bsi and china great wall secure recogonition

    簡介：本公司是一中外合資大型企業，主要產品有電解銅箔、覆銅板，年產電解銅箔5000噸，覆銅板500萬平方米，公司已通過了iso9002認證。
  14. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

    印製電路板用覆箔板.第103部分:印製電路連接專用材料.第1節:多層印製電路板製造用粘結片材的半固化片規范
  15. Base materials for printed circuits - epoxide cellulose paper core, epoxide glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test

    印製電路的基體材料.環氧纖維素紙芯，限定易燃性的
  16. Base materials for printed circuits. part 2 : specifications. specification number 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印刷電路用基材.第2部分:規范. 2號規范:經濟質量的酚醛纖維素紙包銅層壓板
  17. Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3

    印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3
  18. Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5

    印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5
  19. Base materials for printed circuits. part 2 : specifications. specification number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板
  20. Clad sheet steel

    包層薄鋼板
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