copper electroplating 中文意思是什麼

copper electroplating 解釋
鍍銅
  • copper : n 1 銅；紫銅。2 銅幣，銅錢，〈pl 〉零錢。3 銅器；銅罐，銅壺，銅鍋；銅管；銅製品。4 （紫）銅色。5 ...
  • electroplating : 電鍍的
  1. Spectrophotometric determination of cu2 in acidic bright copper electroplating bath by fading reaction of methyl violet

    甲基紫褪色光度法測定酸性光亮鍍銅液中的銅
  2. It use german advanced prescription to produce and manage intermediate and brightener for electroplating of nickle, zinc, copper and so on

    經過多年的發展，已成為國內專業從事研製、開發電鍍化工產品的高新技術企業。
  3. We have imported advanced equipment and instruments as fine carving machines, sparkling machines and wire cutters, etc., focus on the main production lines of stone inlaying, nameplate and sliders, apply aluminum, copper, nickel, stainless steel, fine gold, pure silver, diamond, ruby, sapphire, spar and zircon as the main materials and adopt main techniques as punching, oil pressing, silk - screen printing, polishing, sandblasting, etching, electro - coloring, stone inlaying and surface electroplating, etc. and we are specializing in design, production and sales of metal accessories for mobile phones, computers, digital products and household appliance

    現引進了進口精雕機、火花機、線切割機等先進儀器及設備，以鑲石、銘牌、滑軌為主要生產線；以鋁、銅、鎳、不銹鋼、純金、純銀、鉆石、紅藍寶、晶石、鋯石等作為材質；在製作工序上，有沖壓、油壓、絲印、拋光、磨砂、腐蝕、電染、鑲石、表面電鍍等相關工藝，專業設計、生產、經營各類手機、電腦、數碼產品、以及家電產品上的五金裝飾件。
  4. Taps on the main series of products using high - quality copper material, in italy advanced gravity casting process, fine grinding and polishing as from the surface using seven storeys space electroplating chromium plating method, the leading luster as people

    主要採用優質銅材料，在義大利先進重力鑄造工藝下，經精細打磨拋光而成，表面採用七層太空電鍍法鍍鉻，使龍頭光採照人。
  5. ( 1 ) first, metallizing abs plastics surface by chemical coarsing, metal ion absorption, metal ion reducing and chemical copper - plating. then, the copper - coating was thickened by electroplating in order to improve adhesion between following - coating and plastics matrix, and nickel was preplating. finally, ni - sic composite was plated

    （ 1 ）通過反復實驗，確定工藝流程：首先通過粗化、敏化、活化和化學鍍銅，使塑料表面金屬化，再電鍍銅加厚銅鍍層，增強后續鍍層與塑料基體的結合力，然後預鍍鎳，最後電鍍ni ? sic復合鍍層。
  6. The good adhesion of zinc coating can be obtained. 3. pyrophosphate copper electroplating is conducted by ammonium citrate as a auxiliary complexing agent at around 40, the narrow range of current density can

    3 .焦磷酸鹽鍍銅時採用檸檬酸銨作為輔助配合劑，溫度控制在40左右，電流密度范圍較窄，控制在1 . 0a . dm ~ （ - 2 ）左右，電鍍時間較長，無法達到無孔狀態，所以必須採用酸性鍍銅加厚銅鍍層。
  7. Device of casting etc. nickel cobalt alloy of copper electroplate technology in succession, it adopts the electroplating craft of the assembling type, the electroplating system of the low stress, according to the user s needs, can be constructed and plate different kinds of coppers

    兩國聯合企業millcraft sms services的連鑄機結晶器銅板鎳鈷合金電鍍技術，它採用組裝式的電鍍工藝，低應力的電鍍體系，根據用戶需求，可對不同類型銅板進行施鍍。
  8. On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained

    本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。
  9. Preparation of copper and copper - base alloys for electroplating and conversion coatings

    電鍍層和轉化鍍層用銅和銅基合金的制備
  10. Specification for copper salts for electroplating

    電鍍用銅鹽規范
  11. For the period 2001 - 2005, copper one of the metals commonly used in the pcb and electroplating industries was found in the sediment of all stations in victoria harbour at levels that exceeded the upper chemical exceedance limit

    2001至2005年間，維多利亞港水質管制區沉積物的含銅水平銅為印製電路板及電鍍業常用的金屬之一，均高於化學超標上限，而荃灣附近沉積物的銅銀鉻鎳含量亦高於化學超標上限。
  12. It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance

    結合銅在微電子工業中的應用，綜述了硫酸鹽鍍銅中銅的電沉積機理、銅鍍層微結構、添加劑對銅電沉積過程的影響以及銅電沉積初期行為方面的研究進展。
  13. A review is given on the electrodepositing mechanism of copper from sulfate bath and on the microstructure of the copper coating, the effect of additives on the electroplating process, as well as the research progress concerning copper electrodepositing

    摘要銅的性質決定了銅在工業應用中的重要性，特別是目前在微電子工業中的決定性作用，使銅的電沉積過程成為研究熱點。
  14. Copper sulfate for electroplating use

    電鍍用硫酸銅
  15. In addition, higher levels of cadmium, chromium, copper and other metals are also typically found in the sediment of typhoon shelters around victoria harbour. this contamination appears to be related to discharges between the 1960s and the 1980s from industries involved in electroplating and in the manufacture of printed circuit boards and electronics goods

    另外，維港避風塘沉積物的鎘鉻銅和其他金屬水平一般較高，這種情況與六十年代至八十年代電鍍廠印製電路板廠和電子廠的污染排放有關。
  16. Determination of trace copper in electroplating wastewater by extractive catalytic decoloration spectrophotometry

    催化褪色光度法測定電鍍廢水中的微量銅
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