cte mismatch 中文意思是什麼

cte mismatch 解釋
電纜終端設備失配
  • cte : 第三屆中國國際茶業博覽會
  • mismatch : vt. 配錯，使不適當地配合。n. 錯配；不適當的婚姻。
  1. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  2. So this question must be solved at first. a variety of factors which influence cte mismatch induced thermal stresses such as fiber array, temperature dependent material properties, composites fabrication temperature and pressure has been discussed. on the other hand, the temperature gradient induced thermal stresses is also analysed and factors such as heat treatment conditions, composites fabrication temperature and pressure to influence the stresses are investigated

    本文首先利用ansys模擬基體材料分別處于理想彈性應力狀態和理想彈塑性應力狀態時，各種因素諸如纖維排布模式、模量等性能參數是否隨溫度變化以及復合材料制備溫度和壓力對熱膨脹系數不匹配誘導熱應力的影響；另外，我們也對溫度梯度誘導熱應力進行了一定的研究，分析了各種熱處理工藝以及材料制備溫度、壓力對它的影響。
  3. Two kinds of thermal residual stresses exist in metal matrix composites ( mmc ). one of them is temperature gradient induced thermal stresses caused by temperature gradient in mmc. the other can develop upon cooling from the processing temperature to room temperature due to the coefficient of thermal expasion ( cte ) mismatch between the fiber and matrix and is called cte mismatch induced thermal stresses

    金屬基復合材料（ mmc ）有兩種形式的熱應力，一種是在mmc中由於溫度梯度引起的熱應力，即溫度梯度誘導的熱應力；另一種是在冷卻過程中由於基體金屬和纖維的熱膨脹系數不匹配引起的熱應力，即熱膨脹系數不匹配誘導的熱應力。
  4. Cte mismatch cable temination equipment

    電纜終端設備失配
  5. Obviously, cte mismatch induced thermal stresses is one of the biggest characteristic in mmc because cte mismatch is usually very serious in most of mmc

    顯然，熱膨脹系數不匹配誘導的熱應力是金屬基復合材料的一大特徵，因為對于大多數金屬基復合材料來說，熱膨脹系數不匹配是很嚴重的。
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