curing level 中文意思是什麼

curing level 解釋
硫化度
  • curing : (質粒)清除[從宿主細胞中除去質粒
  • level : n 1 水平儀,水準儀;水準測量。2 水平線,水平面;水平狀態;平面,平地。3 水平,水準;水位;標準;...
  1. Advanced revolving gamma knife was introduced in 1997 which filled the gap in the neurosurgery in fujian province. since then the neurosurgery in our hospital leaped to be one of the few clinic units that can carry out almost all the modern curing technique and indicated we are marching towards the world level

    97年引進了國際先進的旋轉式伽瑪刀,填補了我省神經外科一大空白,使我院神經外科一躍成為能夠開展幾乎所有現代治療技術的單位之一,成為我省神經外科趕超世界先進水平的標志。
  2. The foundation mortar layer for bearing support is used as supporting foundation when laying the piping system and the mixing ratio of cement and sand should be about 1 : 3. be sure to level it well and give perfect curing

    起支持作用的基礎灰漿層在鋪高熱炕供暖管時起支撐作用,灰漿的混和比為水泥:砂1 : 3 ,施工時要可能保持水平,需要徹底養護。
  3. Wall panels with god light solid firewall : minimum and most waterproofing curing and most provincial area, the best free power, the highest level of fire safety, earthquake resistance performance of the best and most noise, the maximum effectiveness, the most convenient construction, the largest span of 10 highly unparalleled advantages

    壁神輕質實心防火墻板具有:最輕、最防水防潮、最省面積、最佳吊掛力、最高防火級別、最佳抗震抗沖擊性能、最隔音、最高功效、最施工方便、最大跨度高度十項無與倫比的優點。
  4. The biocomposite, which needs no additional curing, is directly used to construct the immunosensor at room temperature. the incorporation of bsa into the biocomposite reduces nonspecific adsorption of immunosensors to a lower level

    生物組分在室溫下快速制備且無的孵化,在生物組分中加入一定量的牛血清白蛋白使免疫電極的4po異性吸附降低到一個很低的水平。
  5. When the substrate is alios ceramic substrate, the shear stress hovers over a relatively high negative level during curing process and steps to a relatively low level during cooling down

    對于陶瓷基板,在固化過程中,剪切應力並不象fr4基板上所表現的那樣,在零點上下波動,而是處於一個絕對值較大的負值。
  6. When the substrate is fr4, the surface shear stress and normal stress difference is at a low level and near zero during curing process and build up during cooling down because of the mismatch of ctes of silicon and substrate

    對于fr4基板,在固化過程中,晶元表面的剪切應力和正應力的值很小,其數值在原點上下很窄的范圍內波動。在降溫過程中,熱膨脹系數的失配隨著溫度的降低而越來越顯著,引起應力的積聚。
  7. As to epoxy / toa / org - mmt system, the reaction order was 0. 9 and active energy was 66kj / mol by kissinger method ; and a similar result was obtained by ozawa method. the curing reaction was controlled clearly by diffusion mechanism in the later stage of curing reaction without addition of org - mmt, which leads to the increment of active energy with extend of curing ; as to the curing system with addition of org - mmt, the value of active energy was always kept the same level, which can be explained by the catalytic function of amine salt inserted in the galleries of org - mmt

    對于環氧桐油酸酐有機蒙脫土固化體系用kissinger方法看到固化體系的反應級數均為0 . 9左右,表觀活化能值為66kj mol ; ozawa方法的處理結果與之近似,但從ozawa方法可以看到未加入有機蒙脫土的體系在反應後期固化反應明顯受擴散控制,表現為活化能隨固化程度的增加而增加;而加入有機蒙脫土的體系,其表觀活化能則自始至終表現的較為均勻。
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