cycling stress 中文意思是什麼
cycling stress
解釋
循環應力-
The change of the stress in the composite during the thermal cycling treatment can be evaluated through the analysis of resistivity. the parameters of thermal treatment also can be determined, such as the temperature, the time and the cycling times
通過電阻率分析可以確定復合材料熱循環中的應力變化，確定熱處理參數（即熱處理溫度、保溫時間、循環次數） 。 -
However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。 -
However, the stud welding roots in the negative moment region of the beam are often subjected to the joint action of shear stress cycling of the studs and tensile stress cycling of steel girder flanges
但在負彎矩處栓釘焊趾往往承受栓釘剪應力循環和鋼梁翼緣拉應力循環的共同作用。 -
Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics
電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。 -
In this paper, the linear accumulative damage theory commonly used for calculation of the fatigue of variable amplitude stress is used to assess the fatigue of the same part of the structure due to the two kinds of stress cycling and the assessment formulae for the fatigue of the stud welding roots in the negative moment region are also provided
引入通常用於計算變幅應力疲勞的線性累積損傷理論，對2種應力循環引起的結構同一部位的疲勞進行評定，給出組合梁負彎矩區栓訂焊趾疲勞評定公式。 -
The zijinshan fluid system and the gonglang fluid system were driven by the stress of extrusion nappe onto the basin and the thermal driving force of magmatism. when the fluids cycling in the basin encountered the boundary of reduction - oxidation or underwent fluid mixing, phase separating and fluid boiling caused by fault - induced pressure reducing, the physical chemistry condition abruptly changed and mineralization then took place
在盆地兩側擠壓推覆構造應力及巖漿作用熱力驅動下，紫金山背斜和公郎弧兩大流體系統的流體在盆地中運動，當遇到氧化還原界面或遭受流體混合、相分離及斷裂導致的減壓沸騰時，因物理化學條件發生重大變化而導致成礦作用的發生。
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