density of packaging 中文意思是什麼
density of packaging
解釋
封裝密度-
A study on bonding mechanism of water - based modified starch adhesive used in the packaging of middle density fiberboard of kenaf stalk
水性改性澱粉膠在包裝用麻稈中密度纖維板中膠合機理的研究 -
Select the appropriate density of foam to meet packaging needs, which can range from void - fill applications to high - performance cushioning
從填充空間至高效能護墊的不同需求，選取適當的泡沫密度以符合包裹的需求。 -
Select appropriate density of foam to meet packaging needs, which can range from void - fill applications to high - performance cushioning corrugated liners and inserts
從填補空間至高效能護墊的不同需求，選取適當的泡沫密度以符合包裹的需求 -
Select the appropriate density of foam to meet packaging needs, which can range from void - fill applications to high - performance cushioning corrugated liners and inserts
從填充空間至高效能護墊的不同需求，選取適當的泡沫密度以符合包裹的需求 -
Plastic hollow containner series products adopt high rigidity, anti - transmutation, anti - abrasion, anti - rupture, high - molecule and high density polyethylene as materials. though changing quality, pigmentation and using the international advanced equipments and moulds, puffing plastic hollowly to make up the shape. out products have the quality of high intensity, anti - acid alkali and anti - aging, and have been widely utilized in food, medicine, chemical, petroleum, pesticides and other industries for the external packaging
塑料中空容器系列產品採用剛性大耐蠕變抗磨損及耐環境應力開裂等優點的高分子量高密度聚乙烯作為原料，通過改性著色使用國際先進設備和模具，中空吹塑成型。 -
4. a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology
日沁；司知『匕子封裝己經對，匕于封裝設計提出了更高的要求。 -
Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density
多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。 -
With increasing of packaging density and power, the technologies of cooling and heat dissipation and thermal stress become important problems to be resolved
隨著封裝密度和功率的提高，冷卻和散熱以及由溫度引起的熱應力問題是必須要考慮的重要技術課題。 -
Because the calculation of j - integral is much simpler than other method, and the multilayers and interfaces are ubiquitous in microelectronic packaging structures, it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging, especially
並通過實例證明，此新方法對于界面分層問題是可行的。由於j積分計算十分簡便，因此扁平小矩形路徑j積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應用。 -
The development of high density packaging technology
高密度封裝技術的發展 -
Aluminum infiltrated silicon carbide composite exhibits excellent properties such as high thermal conductivity, low coefficient of thermal expansion ( cte ), high modulus and low density, therefore it has extensive potential applications in electronic packaging
鋁滲碳化硅復合材料具有高導熱、低膨脹、高模量、低密度等優異的綜合性能，在電子封裝領域具有廣闊的應用前景。 -
Testing of packaging ; determining the filling ratio of prepacks ; form relating to coefficients of variation for the density of the packaged material and for the package for adhesives and allied products
包裝的檢驗.預包裝充滿率的測定.包裝材料密度和粘合 -
Plastic films for packaging ; barrier materials made of low density polyethylene
包裝用塑料薄膜.低密度聚乙烯隔擋材料 -
It ' s a method to realize system integration. the hdi substrate is critical to mcm. aluminum nitride ( a1n ) has been considered as a material for ceramic packaging in view of the recent trends in the semiconductor industry toward higher speed, power dissipation and packaging density
Mcm還能夠實現電子系統的小型化、高密度化，是實現系統集成的重要途徑，在mcm中高密度布線的多層基板技術是實現高密度封裝的關鍵。 -
The flip chip technology developed recently provides the shortest possible leads, lowest inductance, highest frequency, best noise control, highest packaging density, greatest number of inputs / outputs ( i / 0 ' s ) and lowest profile when compared with other popular interconnect technologies
新近發展起來的電子封裝倒裝焊技術，具有封裝密度高、信號處理速度快、寄生電容/電感小等優點，是目前最具發展前景的先進封裝技術之一。
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