diametric 中文意思是什麼
diametric
解釋
adj. 形容詞 1. 直徑的。2. 正好相反的。
adv. 動詞 副詞 -cally
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A dynamic fracture analysis of center - cracked brazilian disc specimens under mixed mode diametric impact loading
徑向沖擊中心直裂紋巴西圓盤的復合型動態斷裂分析 -
On the base of the analysis of the static fbd under diametric compression, numerical analysis and compare are performed on the dynamic stress field of the brazilian disk and fbd used in the testing tensile strength under shpb
在對靜態平臺壓縮巴西圓盤（ fbd ）進行的數值分析的基礎上，本文分析了shpb動態劈裂拉伸實驗中巴西圓盤和平臺巴西圓盤的動態應力場，並對結果進行了比較。 -
On the basis of the others, according to the constructional feature of the constitution of the composed soil nails, the computation mode of the he strut frame made of composed soil nails was set up to analyze the distortion of the he strut frame made of composed soil nails when it is stressed. with the engineering data, the strut frame made of composed soil nails is analyzed with the program ababqus, and the effects of the distortion characters, the property of the deposition of the ground, the mechanical property of the soil nails, the variation of the length and the separation of the soil nails, and the diametric of the mixing piles on the strut frame made of composed soil nails, and the distortion property of the strut frame made of composed soil nails under different ground conditions
在總結前人的研究成果下，針對復合土釘墻構造的特點，建立了模擬復合土釘墻受力變形的計算模型，並結合工程實測資料，運用大型通用有限元程序ababqus對復合土釘墻進行了有限元分析，詳細討論了復合土釘支護結構開挖過程中的變形特性、地面沉降性狀、土釘受力性狀；土釘長度變化、土釘間距變化、攪拌樁樁徑變化對復合土釘支護結構的影響；復合土釘支護結構在不同地基條件下的變形特性。 -
In the system, the collimation semiconductor laser - scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made. the beams with the dimension information of two perpendiculars direct are processed by the scanning receive system, the high - speed photoelectric transition and electronic data process. two measured results of the diametric directs and ellipse tolerance, etc, parameter, of the turning workpiece on the same plane are obtained by non - contact automatic measurement
在單向激光掃描檢測技術的基礎之上，提出了一種雙向激光掃描檢測系統，其採用激光掃描檢測技術與特殊光學系統相結合，用準直半導體激光掃描光束對被測工件徑向某一截面的兩個相互垂直方向同時掃描，經掃描接收光學系統、高速光電變換、電子學系統和微機數據處理系統，對將攜帶有垂直方向被測量信息的光束進行處理，實現了回轉體工件同一截面兩個垂直方向的徑向尺寸和橢圓度等參數的非接觸自動測量，解決了同時非接觸測量回轉體零件同一截面兩個徑向尺寸的難題，它具有高速，高精度和非接觸自動測量等特點。
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