die-bonding 中文意思是什麼
die-bonding
解釋
小片接合-
Figure 6 : drawing3 showing wedge bonding operation on the second bond, at the substrate bondinger. figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is onthe die side )
月牙形焊接（熱超聲焊的末端）的尺寸和形狀直接與引線直徑和毛細管的幾何形狀有關。 -
Ztfb photosensitive seal layer edge bonding machine is a special machine, which uses bonding die cavity to electric perm and spin to avoid ink infiltrate
Ztfb型光敏機印章墊封邊機是利用封邊模腔對光敏墊周邊進行電燙，旋壓，使印章與章殼周端邊熔為一體，阻止印墨向外滲漏的一種專用機器。 -
Moving stiffness analysis on the parallel bonding mechanism of ic chip die
晶元粘片機並聯焊頭機構的動剛度分析 -
Abstract : in this paper a new technology for upperpunch in ceramic tile die with isostatic pressing is introduced, static - pressure area ratio and bonding area ratio are changed into independent technological parameters and can be separately designed
文摘:本文介紹了等靜壓瓷磚模具中上模芯的一種新型工藝結構，它使靜壓比和粘貼比成為兩個互相獨立的參數，可以分開進行設計。 -
This product design for ic assembly die bonding process on die bonder machine
本產品是為ic封裝自動貼片機及其貼片工藝而設計。
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