electroless copper 中文意思是什麼
electroless copper
解釋
無電沉銅- electroless : 無電沉
- copper : n 1 銅；紫銅。2 銅幣，銅錢，〈pl 〉零錢。3 銅器；銅罐，銅壺，銅鍋；銅管；銅製品。4 （紫）銅色。5 ...
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Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper - tin codeposition and self - catalyzed deposition, and period of self - catalyzed deposition
從理論上系統地分析了酸性氯化物化學鍍錫的沉積機理，將其歸納為置換反應期、銅錫共沉積與自催化沉積共存期和自催化沉積期三個階段。 -
Meanwhile, fundamental principles about electroless tin plating by reducing agent and disproportionation reaction were explained. function of every component in the bath was explained that complexing agent can effectively change the potential of copper and tin, and accelerate the beginning of replacement reaction favorably ; reducing agent can increase the rate of chemical reaction and has the effect of promoting reaction dynamics too ; antioxidant can effectively prevent sn2 + in the bath from being oxidated ; additive agent a can improve the stability of the bath ; additive agent b has such effects as refining and brightening for the tin deposits, and it enlarges the range of brightening section ; additive agent c used as leveling agent can not only make the depostis level off, but also improve the dispersive ability of the bath ; surface - active agent can solve bubble problem which gathered on the surface of the deposits, and improve the surface quality of the deposits and the bath stability
闡述了鍍液中各組分的作用：絡合劑能有效地改變銅、錫的電位，促使初期的置換反應順利進行；還原劑能加快化學反應速度，對反應動力學有積極的促進作用；抗氧化劑能有效地防止鍍液中sn ~ （ 2 + ）的氧化；添加劑a能提高鍍液的穩定性，添加劑b對鍍層能有細化和光亮作用，擴大了鍍層光亮區的范圍；添加劑c作為平滑劑，不僅能增強鍍層表面的平整性，而且能提高鍍液的分散能力；表面活性劑較好地解決了化學鍍過程中汽泡在鍍件表面聚集的問題，提高了鍍層的表面質量和鍍液的穩定性。 -
Conductive poly ( ethylene terephthalate ) ( pet ) fabrics were prepared by electroless copper and nickel plating
摘要採用化學鍍的方法制備鍍銅和鎳導電滌綸織物。 -
In this paper, nanosized al2o3 ceramic particles were chose as reinforcing phase. enhanced with ultrasonic wave the particles were covered with copper using method by electroless plating, the copper - matrix composite was developed by hot - press sintering process of the composite powder. the composition, microstructure, hardness, density and dry sliding wear property of the new material have been studied
研究路線為：選用納米級al _ 2o _ 3陶瓷顆粒作為增強相，在超聲波的環境中用化學鍍的方法完成對納米al _ 2o _ 3陶瓷顆粒表面的金屬銅包覆，採用熱壓燒結成型技術以復合粉末為原料制備成納米al _ 2o _ 3陶瓷顆粒增強銅基復合材料，研究分析復合材料的成分、組織結構、硬度以及緻密度，對試樣進行了干滑動摩擦磨損實驗。 -
Study of electroless plating for copper hohlraum fabrication
空腔銅靶的化學鍍制研究 -
Technology and application of electroless copper plating
化學鍍銅及其應用 -
Electroless plating of carbon nanotubes with copper
碳納米管的化學鍍銅 -
Pretreatment of carbon fiber for electroless copper plating
化學鍍銅前碳纖維預處理的研究 -
The effect of hydrogen on the ductility of electroless copper deposit is primarily caused by molecular hydrogen contained in voids, particularly the type gb voids
鍍層延展性降低的主要原因是由氫氣泡的缺陷效應，特別是第三類氫氣泡、晶粒邊界氣泡空穴。 -
The assembly shall have a electroless nickel - plated tubular copper body
這種總成應該具有非電鍍鍍鎳層管狀銅閥體。 -
On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained
本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。 -
The main experiments and their results or conclusion are as follows : 1. zn, in, sn and their alloys are electroless deposited on the surface of current collector of copper and zinc alloy successfully. this method has not been reported on reference
用化學方法成功地將金屬鋅、錫、銦沉積到集電體表面，特別是用化學鍍方法在電池集電體上沉積鋅銦、鋅錫、錫銦雙層合金和單層金屬鋅尚未見文獻報道。 -
Electroless copper plating of non - metallic particles and its effects on strength of sintered friction materials
非金屬顆粒鍍銅及對燒結摩擦材料強度的影響 -
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs
化學鍍銅層的顯微結構受基體的顯著影響。 -
Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions
摘要化學鍍銅反應受甲醛氧化過程動力學控制，甲醛氧化為銅離子還原提供電子。 -
In this thesis, electroless plating and its deposition principle were briefly introduced. the progress of electroless plating in the past decade was summarized which includes nickel based alloys, cobalt basd alloys, copper based alloys and iron based alloys
本文介紹了化學鍍以及化學鍍反應的機理，總結了近十年來用化學鍍方法施鍍ni基、 co基、 cu基、 fe基合金的研究進展。 -
In this paper, we tried to get nano - composite powders of metal - coated ceramic by electroless cobalt plating of nano - al2o3 powder. the nano - al2o3 powder used in experiments were about 10 to 20 nanometer, and they were pretreated to produce catalytic activity before the electroless copper plating
實驗中所用的al _ 2o _ 3粉體平均粒徑為10 20nm ，化學鍍銅前進行了必要的預處理，使al _ 2o _ 3粉體表面具有催化活性。 -
Condition optimizing of electroless copper plating for glass fiber
玻璃纖維化學鍍復合材料性能研究 -
Electroless copper platings
化學浸鍍銅 -
Application of uniform design in electroless copper plating on al o powder under ultrasonic irradiation
粉末超聲化學鍍銅工藝中的應用
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