encapsulating resin 中文意思是什麼
encapsulating resin
解釋
封鑄用樹脂- encapsulating : 包封
- resin : n 樹脂；松脂；樹脂狀沉澱物。 resin opal 【礦物】脂光蛋白石。 acrylate [acrylic] resin 玻璃狀可塑...
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Based on the over research, three different kinds of encapsulating materials of epoxy resin are performed
在各種不同制備方法研究的基礎上，選用不同的改性體系制備出環氧灌封材料，並對其性能作了評價。 -
Encapsulating materials of epoxy resin are modified with hgh, nano - sio2 and organophilic montmorillonite, in the present investigation, the microstructue, some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction, electron microscopy and differential thermal analysis measurement techniques
隨著航空、電子等事業的發展，灌封器件的高性能化對灌封材料提出了越來越高的要求。探索制備環氧灌封材料的新方法，尋求提高其使用性能的有效途徑是該領域研究的重要課題。 -
Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved, but the the addition of hgh, the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected. nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin, impact strength reaches 27. 64kj / m2 from 13. 95 kj / m2, flexural strength reaches 136. 68mpa from64. 95 mpa. by addition of the montmorillonite, glass transition temperature and heat distortion temperature of the encapsulating materials are 13. 2 and 16 higher than that of epoxy re
結果表明，活性硅微粉對環氧灌封材料的熱變形溫度和電學性能提高較為顯著，尤其在浸水后，電學性能降低幅度很小，西北工業大學碩士學位論文但活性硅微粉用量較大，材料的工藝性能明顯降低;納米5102對環氧灌封材料具有顯著的增強和增韌作用，沖擊強度、彎曲強度由原來的13 . 95kj / mz和64 . 95mpa分別提高到27 . 64kjzm2和136 . 68mpa 。
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