encapsulation material 中文意思是什麼

encapsulation material 解釋
封鑄材料
  • encapsulation : 包 裹
  • material : adj 1 物質的（opp spiritual）。2 身體上的，肉體上的；物慾的，追求實利的；卑俗的。3 有形的，實體的...
  1. The material, technology and some questions on the encapsulation in current epoxy resin

    環氧樹脂灌封料及其工藝和常見問題
  2. Vacuum processes experience in oled evaporation & encapsulation are advantage. : new graduates in physics, chemical engineering, material engineering, or related majors are also considerable

    （真空工藝?有oled蒸發和封裝經驗者優先考慮?如物理?化學工程?材料工程或相關專業的應屆畢業生也可考慮。 ）
  3. Our lineup includes acrylic resin encapsulation products which are widely used for both corporate and individual purposes, acrylic blocks used for machine parts and display applications, and light storage acrylic products used for door knobs, etc. moreover, our originally developed acrylic jewelry, which traps countless cubic zircons in an acrylic material, is employed by several well - known brands as a form of decoration that has never existed before

    澆注丙烯樹脂的紀念品被廣泛用於公司間往來的饋贈品及個人用途。丙烯滑輪可用於機械部件及展示架，蓄光丙烯則可用於門把手等的部件。另外，我們獨自開發的丙烯仿水晶鑄入無數立方鋯，目前正越來越廣泛地用於很多名牌珠寶首飾中。
  4. After a lot of experiments, we have found the most appropriate material and the best proportion of the two components for the type of the high - voltage isolation optocouplers are found, and concluded some original creative operation processes and rules for encapsulation technique of the high - voltage isolation are concluded the author has done some deeply research in the field of the series of the high - voltage isolation optocouplers, enlarged the application of the optocoupler and

    5 、對高壓隔離特性類光電耦合器的工藝製作、測試方法作了詳細的介紹;通過大量的實驗，找到合適的介質填充材料以及最佳的組分配比，制定灌封工藝操作詳細規范。目前，國外仍無該類型的器件面世，國內也沒有其它的單位在此領域有過或正在深入的研究。
  5. Using the acrylic encapsulation technology it has been accumulating ever since its establishment, crysron manufactures and develops original products in which a variety of different materials are encapsulated in an acrylic material

    使用創業以來發明的丙烯封入技術，進行把各種素材注入到丙烯內部的專有商品的製造和開發。
  6. Selection of tests for material properties of liquid thermoset encapsulating compounds for electronic and microelectronic encapsulation

    電子元件及微電子元件封裝用液態熱固密封化合物材料性能試驗的選擇
  7. Selection of tests for material properties of transfer molding compounds for electronic and microelectronic encapsulation

    電子元件及微電子元件封裝用傳遞模塑化合物材料性能試驗的選擇
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