feed spindle 中文意思是什麼

feed spindle 解釋
進給桿
  • feed : feed1fee 的過去式及過去分詞。vt 1 給…飲食,給…東西吃;給(嬰兒)餵奶。2 喂養,飼養,使吃草,放牧...
  • spindle : n 1 錠子,紡錘。2 (機器的)(主)軸;門鎖的轉軸。3 細長的人[物];長莖。4 〈美國〉松葉。5 錠〈線...
  1. Grinding feature is to use work piece for a slow - speed operation, and wheel spindle selects a high - speed revolution and offers a minor amount of in - feed to cooperate with mechanical spinde for forward and backward movement for finishing grinding jobs

    研磨特性是利用工作物做慢速運轉,而砂輪心軸采高速回轉並給予微量進刀配合機械心軸前後運動完成研磨作業。
  2. Recently its correlative technologies, such as high - speed cutting tool material, high - speed spindle and high - speed feed system developed rapidly. its application range extends widely and widely. it has been applied in many fields, such as aviation industry, automobile industry, die manufacturing and so on

    近幾年來超高速加工的各項相關技術,如高速刀具材料、高速土軸、高速進給系統等都得到迅速發展,高速加工的應用范圍也在不斷的擴大,目前已廣泛應用於航空工業、汽車製造工業、模具加工工業等領域。
  3. Z - axis feed dwell time at the hole bottom in a spot - machining spot cycle. set this time in spindle revolutions

    在一個點加工的點循環中,在該孔底z軸進給駐留時間。在主軸回轉數中設置該時間。
  4. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明,增大砂輪軸向進給速度和減小工件轉速,採用粗粒度砂輪有利於提高磨削矽片的材料去除率,砂輪軸向進給速度對材料去除率的影響最為顯著;適當增大砂輪轉速,減小砂輪軸向進給速度,採用細粒度砂輪可以減小磨削表面粗糙度;在其它條件一定的情況下,砂輪速度超過一定值會導致材料去除率減小,主軸電機電流急劇增大,表面粗糙度變差;採用比# 2000粒度更細的砂輪磨削時,材料去除率減小,矽片表面粗糙度沒有明顯改善。
  5. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床,通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
  6. The spindle is supported by high - accuracy rolling bearing ; the frequency governor imported from abroad is used in the main drive system to realize stepless speed regulation and constant linear cutting functions ; the bed is supersonic frequeney hardened, plastic coated guide ways are used for the carriage ; and stepping motor of acservo motor are used x and z axis to realize feed movement via the ball screws

    主軸採用高精度的滾動軸承支承;主傳動採用進口變頻調速器,實現無級調速功能及恆線速切削功能;床身採用超音頻淬硬處理,採用貼塑導軌; x軸和z軸均採用步進或伺服電機,通過滾珠絲杠,實現進給運動。
  7. The constitution of control system of high - speed cnc engraving and milling machine is analyzed in chapter 3, given emphasis to motion controller, spindle driver and feed driver

    第三章分析了計算機高速數控雕銑伺服系統的構成,著重研究了運動控制器、主軸驅動部分和進給驅動部分。
  8. To raise machining efficiency and make nc machine working in a perfect state, manipulator would constantly adjust feed rate and main spindle speed trim knobs in the operate panel

    為了提高加工效率,操作者在加工過程中根據加工狀況不斷地調整操作面板上的進給速度、主軸轉速這兩個參數的修調旋鈕,使機床工作在較理想的狀態。
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