fill factor 中文意思是什麼

fill factor 解釋
充滿系數
  • fill : vt 1 注滿，裝滿，裝填，填充。2 （風）張滿（帆），使（帆背）受風。3 充滿，充實（知識等）；普及。4 ...
  • factor : n 1 〈英國〉經銷人；（代客買賣收取傭金的）經紀人；代理商；代辦人；〈蘇格蘭語〉 土地經管人。2 要素...
  1. The results indicate that for the same pump intensity, the temperature and thermal stress distribution in the disk are not only related with the medium ' s geometry and the special distribution of pump intensity but also related with the fill factor of pump area

    結果表明，在相同的抽運功率密度下，激光介質中的溫度分佈和熱應力分佈不僅與激光介質幾何構型及抽運光空間分佈有關，還與抽運光斑在介質表面的填充因子密切相關。
  2. The pixel size of p + / n - well / p - sub structure is 100 umx 100 n m, fill factor is 77. 6 %. it can obtain target information with illuminance intensity in the range of 0. 011x ~ 98, 0001x, and the sensor photoelectric sensitivity is 35v / lx ? s. when the method of changeable reset frequency double scanning is used, the photoelectric dynamic range can be 139. 8db, which is high in the 0. 6 um level cmos image sensors already reported

    在對感光單元進行器件物理結構優化的研究中，通過採用深結深光電管結構，提高了傳感器的感光響應，其中p m階」襯底結構的傳感器面積為100umx100urn ，感光面積百分比為77石，可對0刀98 ， 000lx照度的目標信號進行傳感，感光靈敏度大於3sv ix ? s ，採用了變頻兩次掃描后，動態范圍可達139
  3. Rebuilding indexes with a fill factor of 100

    使用填充因子100重新生成索引。
  4. When the fill factor is less than 1, the concentrated tensile stress appeares near edge of disk surface, while the fill factor reaches up to 1, the surface exhibites compressive stress, and the center is less tensile stress

    當抽運光斑未充滿激光介質時，介質的表面靠近邊緣處會出現大的拉應力集中，並且介質表面的最大軸向位移和最大拉應力隨光斑填充因子增大而增大；而當抽運光充滿介質時，表面是壓應力，較小的拉應力存在於介質內部。
  5. For example, you may want the primary key constraint of the table to reference other columns, or you may want to change the column order, index name, clustered option, or fill factor of the primary key constraint

    例如，可以讓表的primary key約束引用其他列，更改列的順序、索引名、聚集選項或primary key約束的填充因子。
  6. Key technologies and its mechanism for improving crystalline silicon solar cells in the scale manufacture have been researched in this thesis. after sioa surface passivation and forming gas treatment utilization in the scale manufacture, the surface recombination and series resistance of solar cells have been reduced while their open - circuit voltage, fill factor and efficiency improved

    本論文研究了提高晶體硅太陽電池效率規模化生產工藝技術的主要環節和相關機理，將sio _ 2表面鈍化、 forminggas處理用於規模化生產，降低了太陽電池的表面復合速度和串聯電阻，提高了開路電壓、填充因子和轉換效率。
  7. If fillfactor is not specified at the same time pad index is set to on, the fill factor value stored in

    如果在pad _ index設置為on的同時不指定fillfactor ，則使用
  8. In some light intensity scope, the open - circuit voltage and short - circuit current increase with the increase of incident light intensity, but the fill factor decrease

    在一定光強度范圍內， npc電池的開路電壓和短路電流均隨光強度增加而增加，但填充因子隨光強度增加而減小。
  9. The result showed that fill factor of bicomponent films electrode was higher than fill factor of titania electrode

    另外，提出了復合薄膜電極的設想，制備了tioz wo3多孔復合薄膜電極，其填充因子高於to 。薄膜電極。
  10. In this work, the dye adsorption reached its highest value with the sample of the greatest porosity, with the fill factor ( ff ) of that sample was 0. 359

    450 - 550溫度范圍內熱處理研究結果表明， 500熱處理樣品具有最高氣孔率。 peg的加入增加了染料的吸附量。具有最高氣孔率的樣品的染料吸附量最大。
  11. To view the fill factor setting, use the

    若要查看填充因子設置，請使用
  12. To view the fill factor setting, use

    若要查看填充因子設置，請使用
  13. This removes fragmentation, reclaims disk space by compacting the pages based on the specified or existing fill factor setting, and reorders the index rows in contiguous pages

    這將根據指定的或現有的填充因子設置壓縮頁來刪除碎片、回收磁盤空間，然後對連續頁中的索引行重新排序。
  14. In doing this, fragmentation is removed, disk space is reclaimed by compacting the pages using the specified or existing fill factor setting, and the index rows are reordered in contiguous pages allocating new pages as needed

    此過程中將刪除碎片，通過使用指定的或現有的填充因子設置壓縮頁來回收磁盤空間，並在連續頁中對索引行重新排序（根據需要分配新頁） 。
  15. Ff of the hpc added titania film was better than that of the peg added film and the films without any additives. at the basis of the above research, the sample with highest fill factor was chosen as electrode to fabricate solar cell

    另外， tio _ 2薄膜的填充因子也隨hpc含量而變化， hpc含量為3m時，填充因子最大，為0 . 59 ，比未加添加劑和加peg的tio _ 2薄膜的都大。
  16. Fill factor values 0 and 100 are identical in all respects

    填充因子的值0和100在所有方面都是相同的。
  17. Percentage is 30, then the fill factor used is 70

    百分比是30 ，則使用的填充因子為70 。
  18. Compaction is based on the existing fill factor value

    壓縮基於現有的填充因子值。
  19. Original fill factor value used when the index was created

    創建索引時使用的初始填充因子值。
  20. Fill factor values 0 and 100 are the same in all respects

    填充因子的值0和100在所有方面都是相同的。
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