fine pitch devices 中文意思是什麼

fine pitch devices 解釋
細間距器件
  • fine : adj （finer; finest）1 美好的，美麗的，優良的。2 （天氣）晴朗的，令人愉快的。3 精製的；華美的；純...
  • pitch : n 1 瀝青；含有瀝青的物質；松脂，樹脂。2 人工合成瀝青；人造樹脂。vt 用瀝青塗。vt 1 扔，投，拋，擲...
  • devices : 措施工藝裝備
  1. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  2. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  3. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  4. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type

    半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形
  5. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  6. Flga. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type

    半導體裝置的機械標準化.表面安裝的半導體器件封裝圖形圖繪制的一般規則.細微間距柵級陣列
  7. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距球面柵格排列的設計指南
  8. Flag. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小爆距紋間表面網格陣列
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