flip chip bonding 中文意思是什麼
flip chip bonding
解釋
倒裝焊接-
Research on the thermode bonding procee for flip chip
倒裝晶元熱電極鍵合工藝研究 -
Flip chip bonding technology used in modern micro - photoelectron package
現代微光電子封裝中的倒裝焊技術 -
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機( flipchipbonder )是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備,適合於特徵尺寸小,鍵合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大規模生產。 -
Mcm flip - chip - bonding technique used in fabrication of cmos - s eed smart pixel
靈巧象素中的應用研究 -
Flip - chip bonding technology
的柔性凸點技術
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