flip chip package 中文意思是什麼

flip chip package 解釋
晶構裝
  • flip : vi ( pp )1 用指頭彈;輕輕打。2 (用鞭子等)抽。3 叭嗒叭嗒地動;翻動紙張。4 跳上車。5 起強烈反應...
  • chip : n 1 碎片,削片,薄片;碎屑;薄木片;無價值的東西。2 (陶器等的)缺損(處)。3 (賭博用)籌碼;〈p...
  • package : n 1 包裝,包紮。2 〈主美〉包,包裹,捆,束,組;(產品等的)(一)件,件頭。3 包裝用物;(包裝用...
  1. Flip chip bonding technology used in modern micro - photoelectron package

    現代微光電子封裝中的倒裝焊技術
  2. Then, the half - empirical paris equation, which can be used as a design base of flip chip package reliability, have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated

    然後由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率,擬合得到可作為倒裝焊封裝可靠性設計依據的paris半經驗方程。
  3. The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations

    本文針對倒裝焊封裝可靠性問題進行了實驗和數值模擬兩方面的研究。
  4. The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique

    為實現更高的功率密度,本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中,完成了一個半橋fc - ipem ( flipchip - integratedpowerelectronicsmodule )模塊。
  5. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容,最後為實現封裝設計標準化和自動化,研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
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