half flip 中文意思是什麼
half flip
解釋
后內點冰半周-
Then, the half - empirical paris equation, which can be used as a design base of flip chip package reliability, have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated
然後由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率，擬合得到可作為倒裝焊封裝可靠性設計依據的paris半經驗方程。 -
The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
為實現更高的功率密度，本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中，完成了一個半橋fc - ipem （ flipchip - integratedpowerelectronicsmodule ）模塊。
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