heat sink 中文意思是什麼
heat sink
解釋
吸熱設備,冷源;散熱片。-
Heat sink for power semiconductor device part 2 : measuring method of thermal resistance and input fluid - output fluid pressure difference
電力半導體器件用散熱器第2部分:熱阻和流阻測試方法 -
Power densities that can be tolerated by a gage are strongly related to the specimen which serves as the heat sink.
應變片所能允許的電能密度與起著散熱器作用的試件密切相關。 -
Heat sink of semiconductor devices - generic specification
半導體器件散熱器通用技術條件 -
Free p4 powerful heat sink with cooling fan
附送強勁p4風扇連散熱油一盒 -
Heat sink of semiconductor devices - heat sink, extruded shapes
半導體器件散熱器型材散熱器 -
Selecting guide of heat sink for power semiconductor device
電力半導體器件用散熱器選用導則 -
Increasing surface area can increase efficiency of aluminum heat sink
亦可增強鋁片散熱的效能 -
How to select the suitable heat sink
如何選擇合適的散熱片? -
Heat sink of semiconductor devices - heat sink, staggered fingers shapes
半導體器件散熱器叉指形散熱器 -
General specification of heat sink of colour television receiver
彩色電視接收機用散熱器.通用技術條件 -
Heat - sink and package datum, pad spacing, gap, length, width, spread, tweeze, missing, broken or un - plated pad
吸熱和封裝數據,襯墊間距,裂口,長度,寬度,伸展,鑷子除去,缺少的,斷掉的,未電鍍引線 -
The heat-sink method has a fast warm-up time.
滲熱法預熱快。 -
High temperature resistant measure is taken to extend its service life significantly in comparing with the tube still hot air furnace, whereas, cross brushing of heat sink by the smoke and negative pressure smoke exhaust are used to ensure a clean heat exchanging position with stable thermal performance
該爐採取了耐高溫措施,從而使其壽命比列管式熱風爐大大延長,並採用了煙氣縱向沖刷散熱片和負壓式排煙方式,換熱部分不積灰塵,無須清理,熱性能穩定。 -
The orbital thermal radiation model of small scale space stations is first finished, then the thermal environmental characteristic of small space stations and the variations of equivalent heat sink are obtained numerically
論文首先建立了空間站在軌熱輻射模型,獲得了小型空間站熱輻射環境的動態變化規律和輻射散熱器等效熱沉的波動特性。 -
Complex heat sink devices, including liquid cooled cold plates and stacked fins with heat pipes
復雜的散熱器產品,其中包括液體冷卻的冷板塊和堆疊鰭片與熱管。 -
Outline dimensions of extruded heat sink for power semiconductor devices
電力半導體器件用型材散熱體.外形尺寸 -
Heat sink for power semiconductor device part 1 : casting kind series
電力半導體器件用散熱器第1部分:鑄造類系列 -
Heat sink for power semiconductor device part 3 : insulators and fasteners
電力半導體器件用散熱器第3部分:絕緣件和緊固件 -
This idealized characteristics can be used for analyzing the converter topology but should not be used for the actual design, when, for example, heat sink requirements for the device are being estimated
這個理想化的特性可以用來分析換流器的拓撲性質但是不能應用於實際設計,例如估計設備所需的散熱器。 -
Micro - jets impingement cooling heat sink is used to cool the high power lda owing to the very thin hydrodynamic and thermal boundary layers in the impingement region when a jet impinges on a surface. reasonable array of jets can develop the uniform of temperature distribution on target very much
微射流陣列冷卻熱沉,是利用射流沖擊在駐點區能產生很薄的邊界層來提高換熱效率的,合理的布置射流孔,可以極大的提高被冷卻表面溫度分佈的均勻性。
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