ic process technology 中文意思是什麼

ic process technology 解釋
集成電路工藝學
  • ic : 1. integrated circuit 【無線電】積體[集成]電路。2. interior communications 內部通訊聯絡。
  • process : n 1 進行，經過；過程，歷程；作用。 2 處置，方法，步驟；加工處理，工藝程序，工序；製作法。3 【攝影...
  • technology : n. 1. 技術，工程，工藝。2. 製造學，工藝學。3. 術語（匯編）。
  1. Adopts vdsm process technology however two outstanding problems are faced to ic layout design when the feature size reaches to 0. 18 m or lower : 1. timing convergence problem seriously affects the circuits schedule, and the interconnect - delay has exceeded more than 70 % of the total circuits ’ delay. 2. si problem, usually it consists two aspects of ir - drop and crosstalk. these problems often affect the chip function after tapout

    本篇論文就是針對超深亞微米階段soc晶元後端設計所面臨的挑戰，提出了運用連續收斂的布局布線策略，尤其是虛擬原型的設計理論，來快速驗證布局，進而提高布線的成功率，並且提出了一種改進的布局評估模型，提高對soc晶元預測布線的準確度;同時，對于時鐘驅動元件選擇，文中提出了一種基於正態分佈模型來達到更有效的選取。
  2. According to the thickness of the soi film, high voltage ic based on soi material ( soi - hvic ) can be divided into thin - film and thick - film. for thin - film soi - hvic, linear drift region doping profile is adopted to satisfy a certain breakdown - voltage, but this process is too complex and its self - heating effect is obvious ; for thick - film soi - hvic, it can take advantage of cmos technology on silicon to obtain the high voltage

    Soi高壓集成電路根據頂層硅厚度可分為厚膜和薄膜兩大類。為了滿足一定的擊穿電壓，薄膜soi高壓電路一般採用漂移區線性摻雜技術，但其工藝復雜，且自熱效應嚴重;而厚膜soi高壓集成電路可以通過移植體硅cmos技術來實現高壓，但是由於其硅膜較厚，介質隔離成為厚膜soi高壓集成電路的關鍵技術。
  3. The implementation of in - chip clock generator is often based on modern cmos ic process technology which is usually adopted by very large scale digital system. while designing a deep sub - micrometer cmos circuit, delay, power consumption and die size are of the main factors that must be considered

    使用現代深亞微米cmos集成電路工藝製造的內部時鐘發生器要綜合考慮延時、功耗、面積等各種重要因素，而且經常要針對soc系統的需求設計特殊的電路結構。
  4. Micromechanical gyroscopes manufactured in ic technology combined with micromachined process has small size, driving and detecting are difficult. nowadays the research of the electronic interface circuit is the key point in the field of micromechanical gyroscopes

    微機械陀螺採用集成電路工藝和微細加工技術製造，尺寸微小，驅動和檢測困難，目前介面電路的研究是微機械陀螺研究的重點和難點。
  5. Resonant pressure sensors are fabricated by ic process and mems technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package

    晶元利用半導體ic工藝和mems工藝製作，採用一種減小封裝應力的結構，完成壓力傳感器的真空密封及封裝。
  6. A concept of ic technology database is presented after ic process is analyzed in detail. the ic fabrication computer - aided management system - icf _ cams is developed according to the model of simplified ic process. the result of icf _ cams running shows that it has the expectant management capability of ic process and that the concept of ic technology database is correct and feasible

    本文首先對ic及其製造工藝以及管理信息系統作了概述，對ic工藝流程特點進行了深入剖析，提出了工藝庫管理模式的概念，並選用了幾個關鍵的單項工藝組成了一個簡化的工藝流程模型，以此模型為原型系統設計開發了一個ic製造計算機輔助管理系統。
  7. Firstly the paper introduces the former development history and the future development direction about ic, then discusses the technology speciality and the application direction for all kinds of ic. secondly, the paper discourse the design & development process of the system hardware and system software in detail, including design of hardware circuit, introduce of the hardware circuit chip, program of the hardware driver, program of the serial communication, design of the multi - process & multi - thread program, database system construction, interface of system software etc. after the finishing of the as - above part, the paper give the interface & result of the system running

    本文首先簡單介紹了智能卡的發展歷史及未來發展方向，討論不同智能卡的技術特點和應用方向，重點對射頻技術和射頻卡進行介紹；然後詳細講述系統硬體和系統軟體設計及開發過程，對硬體電路功能構造、硬體電路採用的晶元、硬體驅動程序的編寫、串口通訊程序編寫、數據庫系統構造和多進程多線程設計的實現及應用界面介面等作了具體詳細的介紹；在介紹完系統硬體和軟體設計后，給出系統的操作界面和部分運行結果；最後對本項目進行總結和展望，給出項目還需要改進的地方。
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