integration density 中文意思是什麼

integration density 解釋
集成密度
  • integration : n 1 結合；綜合；一體化。2 【心理學】整合（作用）。3 【數學】積分（法） （opp differentiation）。4...
  • density : n. 1. 稠密；濃厚。2. 【物理學】濃度；密度；比重。3. 愚鈍，昏庸。
  1. In this thesis, we demonstrate the study of si - based light emitting materials and its importance in si - based photonics integration. we discussed mainly the gain, differential gain, threshold current of si - based quantum - dot laser and the dependence of threshold current on temperature from discrete energy level of three - dimension confined quantum - dot and state density distribution of 5 - function

    本文闡述了si基光發射材料的研究進展及它在硅基光電子集成中的重要地位，從三維受限量子點的分立能級和函數狀的態密度分佈入手，著重討論了si基量子點激光器的增益、微分增益、閾值電流及閾值電流的溫度特性。
  2. Different amount of copies in different tissues attribute to the different density of positive signals. the result of the experiment suggested that the transgenic animals can be produced by spermatozoa - mediated gene transfer after the entrapment of liposome. and because the exogenous dna occurs losing the segments. partly integration, or existin g outside of genome dna, the rate of chimerism is relatively high

    結果表明： （ 1 ）脂質體包裹外源基因轉染精子的方法，可將外源基因導入受精卵中，能夠獲得轉基因動物，並得到了較高的轉基因陽性率； （ 2 ）精子攜帶的外源dna的整合過程是隨機的，在受精過程和胚胎早期分化過程中可能發生了片段丟失、不完全整合或游離于基因組存在而產生嵌合體。
  3. Magnetics is one of the main factors, which limit the power - density and characteristics of power module. for lowing weight and volume, reducing power loss and ripple current, improving dynamic performance, the magnetic - integration technique has been one of the research populations in power electronics. the thesis researches the magnetic - integration applied to the active - clamp forward converter so as to reduce the ripple current and improve its performance

    對于已經大量採用高頻軟開關技術的模塊電源，限制其功率密度進一步提高、性能進一步改善的重要因素之一是磁性元件，而磁集成技術由於具有可以減小磁件體積重量，減少磁件損耗，減小輸出電流脈動，改善輸出動態性能等優點，成為目前電力電子技術的研究熱點之一。
  4. In deep sub - micron technology, the scale of integration and the degree of complexity of circuit increase rapidly, it is necessary and feasible to adopt non - manhattan model for detailed routing in vlsi physical design. aiming at the current pop point a novel non - manhattan otc router is proposed in section 4. according to the routing algorithm of channel area the new otc router selects nets on cell by using net segment valid controlling column technology, deep searching to column density technology and utilization of vacant terminals technology

    結合通道區域所用非曼哈頓布線演算法的特點，通過採用線網段有效控制列技術、列密度深度探測技術及空端利用技術對單元區可布線網進行有效選擇，成功地實現了該非曼哈頓單元上布線演算法，並將其應用於一些經典的benchmark中，和目前文獻中現有演算法相比取得了更優的布線結果。
  5. Silica ( sio2 ) is a very promising material used to fabricate the optical waveguide for its low insertion loss, efficient fiber - to - chip coupling, high integration density and compatibility with microelectronic process. it is possible to realize the monolithic integration of optical devices with microelectronic devices and the passive devices with the active ones

    而硅基氧化硅光波導以其低的插入損耗、能有效的與光纖耦合、集成密度高、可以充分利用現已成熟的微電子技術等特點成為較為理想的實現波導結構的材料。
  6. The information revolution and coming period of ulsi silicon chip, which make the performance integration of chip unit continually increase, drive the demands for larger circuit density and greater performance

    =信息革命及ulsi矽片時代的來臨，使單片功能集成度持續增長，驅動著對更大電路密度和更高性能的需求。
  7. As the density of very large - scale integration ( vlsi ) chips increases, the probability of introducing defects on the chips during the fabrication process also increase

    隨著超大規模集成電路晶元生產技術的發展，單片晶元的集成度越來越高。要想一次生產出沒有任何缺陷的晶元已不太可能。
  8. As integration density increased dramatically, energy consumption has become the critical concern of soc design

    隨著設計規模的急劇擴大，功耗成為電子產品的關鍵指標。低功耗已經成為soc設計的主要挑戰。
  9. It has many advantages including excellent device isolation function, less parasitic effects among different parts, high speed, good radiation toleration, and high integration density, etc. consequently, high voltage soi spic has become a new field of power integrated circuit research

    它具有器件隔離性能好、器件間的寄生效應小、電路工作速度高、抗輻射能力強和集成度高等優點。因此基於soi的高壓智能功率集成電路已經成為功率集成電路研究的新領域。
  10. To improve the integration density of ics, according to the moore law to develop, craftwork must get great breakthrough. vlsi will not be satisfied with the conditional devices " size, silicon technology will slow down till to break down in the next ten years or much shorter time

    對于跟器件尺寸密切相關的超大規模集成電路vlsi來說，傳統的工藝尺寸已經逐漸不能滿足當前集成電路的發展要求，矽片技術迅速發展的勢頭有可能在十年內（甚至更短的時間內）放慢以至完全停頓下來。
  11. It ' s a method to realize system integration. the hdi substrate is critical to mcm. aluminum nitride ( a1n ) has been considered as a material for ceramic packaging in view of the recent trends in the semiconductor industry toward higher speed, power dissipation and packaging density

    Mcm還能夠實現電子系統的小型化、高密度化，是實現系統集成的重要途徑，在mcm中高密度布線的多層基板技術是實現高密度封裝的關鍵。
  12. Total investment 1. 500 million yuan, introduce the shanghai man - made trigger equipment plant production now the most advanced equipment, uses take computer technology as the main body integration of machinery newest technical craft, the leading product for the center density and the high density fiberboard, the strengthened floor base material, has yearly produces 20 - 250, 000 cubic meters plates the productivities

    總投資1 . 5億元，引進上海人造板機器廠生產的當今最先進的設備，採用以計算機技術為主體的機電一體化的最新技術工藝，主導產品為中密度及高密度纖維板、強化地板基材，具有年產20 25萬立方米板材的生產能力。
  13. Multi - beam sounding system ( mbss ) is a high - density integration of modern signal processing, computer application, high precision navigation and positioning and other technologies

    多波束測深系統是現代信號處理技術、計算機技術、高精度導航定位技術等多種技術的高度集成。
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