interconnection level 中文意思是什麼
interconnection level
解釋
互連層- interconnection : n. 相互聯系。
- level : n 1 水平儀，水準儀；水準測量。2 水平線，水平面；水平狀態；平面，平地。3 水平，水準；水位；標準；...
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After 1990s, information industry and data traffic network have greatly mushroomed and influenced industrial automation. new type industrial networks such as dcs, fieldbus and industrial ethernet have brought a high - level revolution in industrial automation. however because of the disunion of the international standards of fieldbus and indirect interconnection and interoperation between different kinds of fieldbus products, the openness of fieldbus can not be achieved easily
90年代以來，以internet為代表的計算機信息產業和數據通信網路蓬勃興起，發展迅速，同樣也對工業自動化領域形成了強大的沖擊，新型的工業計算機網路如新型集散控制系統（ dcs ） 、現場總線（ fieldbus ） 、工業以太網（ industrialethernet ）等大量涌現，給工業自動化帶來一場深層次的革命。 -
After the switching of the numbering mode, services can be displayed and configured on the basis of lucent s numbering mode. but at that time since there was no network - level nm in beijing telecom s transmission network and the lct ( pc - based element - level nm ) could display and configure services only on the basis of huawei s mode, the configuration mode needed to be modified manually when implementing interconnection to lucent s equipment and each adjustment had to be made according to lucent s numbering mode through the built - in cross connection function while configuring services
轉換后，即可按朗訊的編號方式在網管上顯示業務與配置業務。但當時北京電信的華為傳輸網未建立該網路級網管，而lct （基於pc的網元級網管）只能以華為公司的時隙編號方式顯示與配置業務，在與朗訊對接時需要人工修改配置方式，通過sdh設備的內置交叉功能在配置業務時按朗訊公司的編號方式一一調整。 -
Followed above, this dissertation has much content about the hardware design which include dsp, fpga, ddr sdram memory bank interface circuit, pci, power circuit, board - level interconnection design. this part puts much emphasis on key circuits many of which require us to have deeply known the components adopted and involved specifications
這部分主要是對電原理圖的重要地方和需要注意的地方進行重點闡述，包括dsp 、 fpga 、 ddrsdram內存條介面電路、 pci介面電路、電源、板級互連等部分。 -
Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density
多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。 -
On interconnection technology of high level architecture multi - federations
高層體系結構多聯邦互連技術研究 -
Extensions of the application of safety level to the fault tolerance routing algorithms in interconnection networks
在互連網路容錯尋徑演算法中的應用推廣
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