interfacial aging 中文意思是什麼
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Abstract : positron spectroscopy is a new and sensitive microanalytical probe for characterization of polymer microstructures. we report recent advances in this area, including studies on the free volume properties, structural transition, miscibility of blending polymers, physical aging, doping of functional polymers, interfacial interaction of multiphase polymers, etc
文摘:簡要介紹了近年來正電子譜學在聚合物微結構研究中的主要應用及進展.大量實驗事實表明，正電子譜學是表徵高聚物微結構的極靈敏方法 -
A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。 -
The research work can be divided into two parts : 1. research on the interfacial bond of new - to - old mortars. this paper has research on the bond performance under the conditions of different curing systems, bond method aging and proportion, by means of " 8 " mould and giving preliminary discuss on the mechanism of different materials by use of sem
本文的研究工作可主要分為以下兩大方面： 1 、新老砂漿界面粘結的研究採用「 8 」字型新老砂漿粘結抗拉粘結強度的試驗方法，研究了多種界面粘結材料在不同養護制度、不同粘結方法、不同齡期、不同配比條件下的粘結性能，並利用掃描電鏡對界面微觀結構進行了分析，對各種材料粘結改性機理進行初步探討。
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