lead-free 中文意思是什麼

lead-free 解釋
adj. 形容詞 無鉛的。

  • lead : n 1 鉛，鉛製品。2 【航海】測鉛，測深錘，水砣。3 〈pl 〉（鋪屋頂的）鉛皮；鉛皮屋頂；【印刷】插鉛，...
  • free : adj （freer; freest）1 自由的，自主的；自立的。 a free action 自由行動。 free competition 自由競...
  1. Research and development of sn - ag - sb lead - free based solders

    系列合金的研究與開發
  2. Lead - free soldering stations, intelligent rework stations, soldering pot, ionizing air guns, smoke absorber, glue dispensers, soldering multi - testers, industrial tools

    無鉛焊臺、無鉛拆焊臺、無鉛熔爐、離子風機、吸煙儀、滴膠機、烙鐵綜合測試儀、工業工具等。
  3. The challenge of changeover to lead - free in electronic packaging

    電子封裝面臨無鉛化的挑戰
  4. To further reduce equivalent series resistance and improve long term reliability, the leads are then soldered with lead free silver solder

    為了進一步的減少等效串聯阻抗和改善，長期的信賴度，引線是以無鉛銀焊錫來接焊
  5. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛焊料接頭中金屬間化合物在時效中的演變
  6. The use of lead-free petrol is now being phased in.

    無鉛汽油的應用現正逐步推廣。
  7. The imported transparent glaze fired at lower temperature was analysed semi - quantitatively by adopting emission spectroscope. the stripping of lead and cadmium from this transparent glaze fired at lower temperature in ceramic product was determined by atomic absorption spectroscope. the effect of chemical composition on the stripping of lead and cadmium was analysed. upon the author s opinion, the overproof lead stripping from the imported transparent glaze fired at lower temperature can only be settled by adopting lead - free glaze instead of adopting low - lead prescription. the author succeeded in developing an excellent lead - free transparent glaze fired at the lower temperature of 1000 1050. the success is based on an inquiry into the feasibility of using such new agents of fusion as li2o and sro in replacement of pbo ; and on a study of the effects of the contents of sio2 ， al2o3 ， b2o3and other metallic oxides on such performances of glaze as coefficient of linear expansion, fusion temperature and transparency. it is also based on an analysis of coefficient of linear expansion of blank and glaze on an analysis of coefficient of linear expansion of blank and glaze on their correlation ; and on a study of technology for preparing glaze

    採用發射光譜儀對進口低溫透明釉進行半定量分析，並用原子吸收光譜儀測定其陶瓷製品的鉛、鎘的溶出量，分析化學成分對鉛、鎘溶出量的影響.結果表明，進口低溫透明釉採用低鉛配方不能解決鉛溶出量的超標問題，只有採用無鉛釉才能解決.探討用氧化鋰和氧化鍶等新型熔劑完全代替氧化鉛的工藝，研究釉料中氧化硅、氧化鋁、氧化硼和各種金屬氧化物的含量，對釉的線膨脹系數、熔融溫度和透明度等性能的影響.分析坯料、釉料的線膨脹系數及其相互關系和釉料制備的工藝，研製出優質的1000 1050低溫無鉛透明釉
  8. Familiar with lead - free solder paste and at least 3 years related sales experience

    熟悉無鉛錫膏產品及市場，具備3年以上行業銷售經驗。
  9. Electronic tools, lead - free products, communication tools, esd products, network tools, advertising light box etc

    電子工具，無鉛產品，通訊工具，防靜電產品，網路工具，廣告燈箱等。
  10. No. 1 market share in japan for lead free soldering equipment as n2 / air reflow, n2 / air wave soldering system & spray fluxer. we also can provide soldering chemical materials

    全日本銷售和佔有第一，無鉛製程設備如氮氣?空氣回焊爐，氮氣?空氣波峰焊爐等。我們也提供無鉛錫膏，電子化學材料等。
  11. Research progress of bi0. 5 na0. 5 tio3 based lead - free piezoelectric ceramics

    基無鉛壓電陶瓷研究進展
  12. Development of na0. 5 bi0. 5 tio3 based lead - free piezoelectric ceramics

    3基無鉛壓電陶瓷材料的研究進展
  13. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  14. Lead - free solder and conducting resin packaging technology involved in lead - free packaging are analyzed. the technological differences between the traditional tin - lead welding and lead - free welding are also described. finally, some technical difficulties in promoting lead - free packaging technology are presented

    從無鉛組裝的角度出發，詳細分析了無鉛組裝技術涉及的無鉛焊料和導電膠組裝技術，闡述了傳統的錫鉛焊接與無鉛焊接的工藝差異，提出了該技術要推廣應用所面臨的技術難點。
  15. Will your lead free components have unique part numbers from components that contain lead

    你們會有專用的型號用於無鉛產品和含鉛產品，以便區分
  16. Will lead free components require any new process equipment or equipment replacement ? if so, please list

    無鉛化的產品需要一些新的機臺設備或會有一些現用機臺被替換嗎?如有.請列出
  17. In the transition from lead to lead - free, for the manufacturers of electronic products, there is expected to be a period when lead and lead - free materials will be used within the same mounting process, the mixed solder joint which formed in this situation is very complicated

    摘要在從有鉛向無鉛轉換過程中，電子產品製造商不可避免會碰到同一組裝過程中有鉛和無鉛同時存在的混合情況，這種情況下形成的混合焊點是很復雜的。
  18. Lead - free gasoline

    無鉛汽油
  19. Ltd has imported 100 sets automatic production lines to produce neon lamps and environment protected lead free neon lamp. annual productivity is up to 1. 3 billion pieces ; it is the largest neon lamp manufacturing and exporting base in the world

    公司引進100條全自動氖燈流水線，年產ne系列指示氖燈無鉛氖管13億支，是全球最大的氖燈生產出口基地
  20. The group commenced r d of lead - free soldering technologies in 1999 and successfully introduced its first lead - free model in may 2000. more than 150 lead - free soldering systems have been sold since then, but sustained growth is observed

    集團早於一九九九年已開始研發無鉛焊接工藝，於二零零零年五月成功推出無鉛波峰焊接設備，至今已生產了150臺無鉛焊接機，訂單數目持續增長。
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