low-melting-point 中文意思是什麼

low-melting-point 解釋
低熔點的
  • low : adj 1 低的；淺的，矮的。 low flight 低飛。 a low temperature 低溫。 low tide [water] 低潮。 The g...
  • melting : adj. 1. 融[熔]化的。2. 心軟的，受感動的，易感動的。3. 使人感動的，使人感傷的，溫柔的，動人的。
  • point : n 1 尖頭，尖端；尖頭器具；〈美國〉筆尖；接種針，雕刻針，編織針；小岬，小地角；【拳擊】下巴。2 【...
  1. The main results are shown as follows : 1. bt _ 4 doped with cuo could be sintered in a lower temperature, because cuo has a low melting point. there isn ’ t any other phase in the samples. the dielectric properties decreased because cuo was non - crystalloid

    本人工作的主要研究成果如下: 1 . bt _ 4摻雜低熔點的cuo能降低樣品的燒結溫度，沒有其他相生成，燒結后cuo以無定形態的形式存在，導致樣品介電性能降低。
  2. Standard specification for low melting point alloys

    低熔點合金的標準規范
  3. Used the genomic dna extracted by low melting - point agarose embedding method as pcr template, the full length of structural genes of bacillus subtilis bio operon were gained by long pcr method

    將該方法提取的基因組dna稀釋100倍作為模板，採用長距離pcr方法，獲得了枯草桿菌生物素操縱子基因全長。
  4. The low - melting - point sn - pb - bi alloy was used as simulacrum to investigate the distortion of meniscus

    結果表明：當電源輸入頻率增大時，結晶器內的磁感應強度減小。
  5. The results also explained that it was feasible that the genomic dna of bacillus subtilis were extracted and gained large dna fragments by low melting - point agarose embedding method

    說明以低熔點瓊脂糖包埋法提取枯草桿菌基因組dna ，並獲得較大的dna片段，是完全可行的。
  6. Extraction of large - fragment genomic dna in order to gain dna template of pcr amplification ( long pcr amplification and salvage pcr amplification ) which was high purity and large fragment, three methods were used to extract genomic dna of bacillus subtilis, i. e. low melting - point agarose embedding method, sds - proteinase k - phenol chloroform extraction method and bacterial genomic dna extraction kit method. the genomic dna of bacillus subtilis were gained by these methods, and the operated programs of the methods were improved. the results showed that the genomic dna extracted by low melting - point agarose embedding method were obviously biggest than that of another two methods

    大片段基因組dna的提取為了獲得用於pcr擴增（長距離pcr擴增和分段pcr擴增）的高純度、大片段（至少為pcr產物長度的4倍）的dna模板，應用三種方法：低熔點瓊脂糖包埋法， sds -蛋白酶k -酚氯仿抽提法和細菌基因組dna提取試劑盒法，分別提取獲得了枯草桿菌基因組dna ，並對3種方法的操作程序進行了不同程度的改進，結果表明：低熔點瓊脂糖包埋法提取的基因組dna片段明顯大於后兩種方法，採用0 . 5瓊脂糖凝膠電泳3h ，仍然跑不出加樣孔。
  7. Mainly made of super - fine three - dimensional staple fibers and mixed with some polyester staples of low melting point and finished products scarcely containing glue materials. after being calenderized and ironed, the product get smooth surface, silk - like glittering effect, light and exquisite hand feeling, softness, heat preservation, good washing endurance, no distortion and leaking. it feels like down but with fine tenacity and is the best among all spray bond padding products

    用超細三維中空短纖維為主要原料，配以部分低熔點滌綸短纖，成品含膠量極少，經過軋光燙平后，仿絲綿表面平整、有絲光、輕薄、手感細膩、柔軟、保溫好、耐水洗性極強、不易變形、不會跑毛、手感似羽絨，具有質地纖細、表面如蠶絲、有拉力、柔軟等特點，是噴膠棉中最高擋的產品。
  8. Rubber protective wax is made from paraffin wax with low melting point, paraffin wax with high melting point and polyethylene wax

    橡膠防護蠟，是由低熔點石蠟、高熔點石蠟、微晶蠟和聚乙烯蠟製成的。
  9. The low melting point of polyethylene allows for closure of pores and reduction of flow through them at elevated temperatures

    此聚合物的低融點性可以在更高的溫度下關閉毛孔並減少流量。
  10. The maximal power outputs of 37. 0 mw / cm2 and 30. 0 mw / cm2 for the p - and n - type laminated materials respectively at the temperature difference 490 have been experimentally obtained, which are about 2. 5 and 3. 0 times those of - fesi2. chemical analyses show that the interface failure between the bridge alloy and the semiconductor bi2te3 results mainly from the eutectic mixtures with low melting point and brittle compounds formed during welding and long time annealing at 190. it is found that the electrical properties of a laminated structure are mainly controlled by the wettability of the bridge alloy on the semiconductor surface

    發現： 1 ）疊層材料具有明顯優于均質材料的熱電性能，在490溫差下， p -型和n -型疊層材料的最大輸出功率分別達到37 . 0和30 . 0 （ mw / cm ~ 2 ） ，是同類型均質- fesi _ 2的2 . 5和3倍； 2 ）在焊接過程和190長時間退火處理過程中，焊接過渡層合金和基體半導體（特別是bi _ 2te _ 3 ）之間存在明顯的元素相互擴散，從而在過渡層中形成一些低熔點共晶體和脆性化合物，這是導致疊層材料破壞的主要原因； 3 ）焊接過渡層合金與半導體基體之間的潤濕性是影響界面層電性能的主要因素。
  11. Low melting point alloy die

    低溶點合金模
  12. In this paper, the structure of fed, operation principle of fed and the manufacturing process were presented at first. emphasis of this paper was put on the investigation in low melting - point glass sealing technique and gas exhausting technique

    本文首先對fed平板顯示器的結構、工作原理、製造工藝過程進行論述，重點論述了對fed平板顯示器件的低熔點玻璃封接及除氣工藝的研究。
  13. There are three types of wall sticking : half wet materials, materials with low melting point, dry powder

    噴霧乾燥粘壁主要有半濕物料粘壁、低熔點物料的熱熔性粘壁和乾粉表面粘附三種類型。
  14. Low melting point alloy

    低熔點合金
  15. The application of low melting point alloys in resisting concaves in the bending of profiles

    低熔點合金在克服型材彎曲凹陷中的應用
  16. The semi - solid forming technique of low melting point alloy has been used in commercial production

    摘要低熔點合金半固態成形技術被專家稱為21世紀新興的金屬製造關鍵技術。
  17. Cao and y2o3 are additives in a1n green sheet. ya1o and caalo complex oxides have low melting point compare to the soaking temperature of a1n sintering

    通過改變導帶漿料中sio _ 2的含量，在促使導帶漿料完成燒結的同時，在導帶中也保留一定數量的孔隙。
  18. It is not only a radiotherapy reform but a practical and effective treatment that the moulding of low - melting - point lead is used to supplement conventional and normal lead block

    摘要用低熔點鉛合金澆鑄的辦法補充傳統的標準式鉛擋，是放射治療界進行普通放療的一項改革，也是一種切實有效的治療方案。
  19. The advantage of al is its applicability to non - conducting substances and also to low - melting - point metallic materials. due to the fact that the levitation capability of single - axis acoustic levitation ( saal ) is comparatively weak and its applications are mainly limited to low - density substances, this paper aims at enhancing the levitation capability of saal and realizing the containerless solidification of those materials with low melting temperature and high density

    本文針對當前單軸式聲懸浮能力較弱，而且主要應用於低密度材料無容器處理的研究現狀，以提高聲懸浮能力、實現低熔點高密度材料的聲懸浮無容器凝固為主線，採用理論和實驗相結合的方法，對單軸式聲懸浮過程及其主要影響因素進行了較為系統、深入的研究，主要取得以下幾方面的研究結果。
  20. But its sintering temperature is so high that it cannot be sintered under 1000 with low melting point electrode materials like ag, cu etc. presently investigations about this material are mainly via glass - ceramic technique to decrease the sintering temperature and the dielectric loss is high. for the first time, this investigation manufacture a casio 3 system low dielectric and high frequency microwave dielectric ceramic via tape casting with basic material altered and additives doped

    本文以casio _ 3體系為研究對象，首先對casio _ 3體系進行改性，並首次採用li _ 2o和bi _ 2o _ 3作為燒結助劑，降低體系燒結溫度，在此基礎上，採用catio _ 3調節陶瓷的頻率溫度系數，制備出微波介電性能優良的具有工業應用價值的casio _ 3系ltcc低介高頻微波介質陶瓷。
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