module packaging 中文意思是什麼
module packaging
解釋
模塊包-
Finally, sca defines a standard deployment model for packaging components into a service module
最後， sca定義了一個標準的部署模型，用於將組件打包到服務模塊。 -
Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
本文對金剛石材料在多晶元組件熱性能改善和熱應力研究，對金剛石在多晶元組件封裝熱設計應用具有一定的參考價值和提供一定的理論依據。 -
Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。 -
The company ' s primary business is ic component packaging and test and memory module assembly
公司的主要業務是集成電路封裝測試和內存模塊裝配。 -
With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on
多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。 -
Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density
多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。 -
We are dedicated to becoming the top - rated supplier at each of our customers in the electronics value chain - from semiconductor fabrication, to device packaging and complete module and system assembly
從半導體製造、元器件封裝到電子模塊的裝配與保護，道康寧提供的創新性解決方案可應用於電子產業價值鏈的各個環節。 -
According to the present condition of the packaging cad, the paper analyzes necessity and possibility of developing material module of 3d packaging cad, provides the viable method on theory, sums up experiential model and puts forward concrete method. first, the paper analyzes how to establish the 3d model for material function studying by using computer graphics technology and reasonable date - construction
本文從目前包裝cad的現狀出發，分析了開發三維包裝cad系統材質功能模塊的必要性和可行性，為三維包裝cad系統材質功能模塊的開發從理論上提供了可行的方法和總結出經驗模型，並且編程實現了這些模型，進而為開發商用三維包裝cad系統軟體中的材質功能提供了基礎。
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