package assembly 中文意思是什麼
package assembly
解釋
外殼組裝-
The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end. the critical length was about 12m for the assembly with no - flow underfill and 20m for the package with capillary - flow underfill at 20 ?
模擬表明，山固化溫度冷卻到室溫時，所研究的倒裝焊封裝在填充不流動膠時晶元斷裂臨界裂紋長度為12pm ，而填充傳統底充膠時為20hm 。 -
Full & half size package for pcb assembly
全形，半形尺寸供不同電路板組裝。 -
It has the standard two person, the single apartment and the luxurious distinguished guest flatlet, may provide warm for the guest, is comfortable, the sibilant table lodgings environment ; the spacious luxurious assembly hall as necessary receives the size conference ; fused hides the chinese decorates of of of the style the chess sign room, the waiter, the traveling store between the elegant majestic quick dining room, the banquet hall, the luxurious package, the bar, may simultaneously receive several hundred people
它擁有標準雙人間、單人套間和豪華貴賓套房，可以為賓客提供溫暖、舒適、字根表的住宿環境；寬敞豪華的會議廳隨時接待大小會議；融合了藏漢裝飾風格的典雅堂皇的快餐廳、宴會廳、豪華包間、酒吧、棋牌室、茶房、旅遊商店可同時接待數百人。 -
3pl providers not only provide the traditional transportation service, warehouse management and shipment consolidation, but also carry out light assembly and package, order fulfillment, inventory management, and door - to - door services by using multi - modal transportation
第三方物流服務供應商不但提供傳統運輸服務、倉儲管理和貨物集運，而且還進行簡單裝配及包裝、履行訂單、存貨管理，以及利用多式聯運提供門對門服務。 -
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. part of the assembly process
在微電子中，使用電線將數據包的引線與晶元上的結合區相連接的過程。裝配過程的一部分。 -
The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
為實現更高的功率密度，本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中，完成了一個半橋fc - ipem （ flipchip - integratedpowerelectronicsmodule ）模塊。 -
Sensor window cotton improved image quality, access dry wet fingers. automated exposure and intelligent compensation improved image quality accept odm or oem, providing system analysis, casing - making, circuit design, producing - assembly, package design, etc, linear service
U . are . u指紋儀在新版中標配，全面提升指紋識別質量支持射頻卡等卡類設備輸入和輸出，可配置id卡mifare卡多種方式考勤 -
As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem
三維疊層晶元尺寸封裝（ stackedchipscalepackage ）是目前最先進的微電子封裝形式之一，具有體積小、重量輕、封裝效率高等特點。 -
Central to this re - engineering endeavour is the catia product model tool : a software package that allows manufacturers to simulate all the industrial design processes, from the pre - project phase through detailed design, analysis, simulation, assembly and maintenance
重新安排作業流程這一努力的核心是catia產品模型工具：它是一個允許製造者模擬所有工業設計過程的軟體包，從原型過程直到細節設計，分析，模擬，組裝和維護。
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