package technology 中文意思是什麼

package technology 解釋
包裝工藝
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  • technology : n. 1. 技術，工程，工藝。2. 製造學，工藝學。3. 術語（匯編）。
  1. Zhejiang xinda machine factory is member of china package association, the professional enterprise of manufactureing plastic packing machinery, the state star spark project - undertaking member, the provincial science technology star spark demonstration enterprise, award of the provincial science and technology progress, award of the advance enterprise at wenzhou and pingyan, we gain the title of respecting compact and keeping faith of provincial and local area unit and aaas bank credit enterprise title many times

    浙江鑫達機械廠是中國包裝協會會員，是專業生產塑料包裝機械的頭企業是國家星火項目承擔單位省級科技星火示範企業，曾榮獲多項省部級科技獎技術創新獎是溫州市文明先進企業是平陽縣重點工業企業是產品質量信得過工業企業並多次獲得本地區重合同守信用aaa銀行信用企業稱號。
  2. Flip chip bonding technology used in modern micro - photoelectron package

    現代微光電子封裝中的倒裝焊技術
  3. As one of the contracted agricultural technology extension project in shanxi province, the jinnan cattle feeding and management technical package exte nsion project, assigned by science and technology committee of shanxi province i n 1999, directed on the problems, such as extensive cattle feeding and managemen t, low sale percentage of commercial beef cattle, low meat production, low repro ductive survive rate of cows and poor economic returns, to increase the scientif ic contents and economic returns of cattle industry by adopting technical packag e including beef cattle crossbreeding, beef cattle feeding and management, cow ' s feeding and nutrition, calf raising, stover processing, and supplementation for grazing cattle in winter and spring etc

    「晉南牛飼養管理配套技術推廣」是山西省科委1999年度下達「山西省農村技術承包」項目，其目的是針對我區廣大農戶養牛飼養管理粗放、商品牛出欄率低、產肉率低、母牛繁殖成活率低、經濟效益差等缺點，通過採用肉牛雜交改良、改良肉牛飼養管理、加強母牛飼料營養、犢牛培育、秸稈氨化、放牧牛冬春補飼等配套技術，達到提高養牛業科技含量，增加養牛業經濟效益的目的。
  4. Bare copper flat wire technology is adopted for wire package, with h class insulant as bedding to realize functions like ： quick heat dissipation, high efficiency and long working life

    線包採用絲包銅扁線技術工藝，用h級絕緣材料墊層，散熱快、效率高、壽命長。
  5. Study on sulfurized isobutylene in package lubricant additives by apci - ms technology

    硫化異丁烯的大氣壓化學電離質譜研究
  6. Our technology competences are concentrated around mechatronics, system in package and digital systems

    我們的技術強項主要表現在機電產品、系統級封裝和數字系統方面。
  7. Wamow company provides raw material and oem package of crystal collagen mask for worldwide suppliers. the raw material of crystal collagen is composed lf natural medical ingredients, and is the best beauty and moisturizing product. it utilizes bio - genetic engineering technology to compound ossein, hyaluric acid, and red algapolymer, as well as water solvable collagen, to produce the very best crystal collagen raw material, which is also known as “ fountain of skin “

    華茂貿易公司在中國內地是膠原蛋白水晶面膜原材料最大供應商，而且我們也可以?國內化妝品企業提供水晶面膜生?工藝流程，可以指導客戶組織生?出如：金箔元素系列、水果果素系列、花草茶系列、香熏水晶蠟系列、中華草本系列、海洋元素系列、純晶骨膠原系列等十大系列100多個品種的天然水晶蛋白膠原膜貼成品。
  8. Ultrathin wafer level chip size package technology

    超薄型圓片級晶元尺寸封裝技術
  9. Package technology and trends of surface acoustic wave devices

    聲表面波器件的封裝技術及其發展
  10. At present, bga / csp is becoming the mainstream of the advanced ic package technology

    目前微電子球柵陣列尺寸封裝（ bga csp ）正成為高端ic封裝的主流技術。
  11. Csp causes the revolution of memory chip package technology

    引發內存封裝技術的革命
  12. The development of memory chip package technology

    內存晶元封裝技術的發展
  13. Development of cpu chip package technology

    晶元封裝技術的發展演變
  14. The development of cpu chip package technology

    晶元封裝技術的發展
  15. First, the paper discusses briefly the ic package technology, the reliability analysis methodologies and the current situation of the ic package

    本文首先對晶元封裝及其可靠性分析方法及現狀進行了概述，並對相關理論方法作了介紹。
  16. Much attention has been focused in recent years on the research of fbg sensor package technology and the temperature and strain separation method. these two issues are the key problems for good practical application of the fbg sensors

    光纖布拉格光柵傳感器的封裝技術與測試結果中的應變/溫度效應分離技術都是目前國內外研究的熱點，也是光纖布拉格光柵傳感器應用於實際工程結構的重要先決條件。
  17. Chapter three studies the current package technology of fbg and the virtue / defect, applying case of them

    本文的第三章研究了光纖布拉格光柵傳感器的常用封裝方法和它們各自的優缺點與適用場合。
  18. The development of chip package technology

    晶元封裝技術的發展演變
  19. Introduction of the chip package technology

    晶元封裝技術介紹
  20. The advanced chip package technology

    先進晶元封裝技術
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