physical sputtering 中文意思是什麼
physical sputtering
解釋
物理濺射- physical : adj 1 物質的，有形的，形而下的 （opp psychical spiritual mental moral）; 確鑿的；外界的。2 身體的...
- sputtering : 飛濺
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The applications field of fgm include aerospace, electron, chemistry, biology and medicine fields ; the composition change also from metal / ceramic to metal / metal, metal / alloy, non - metal / non - metal and non - metal / ceramic. moreover, various methods including powder metallurgy, self - propagating high - temperature synthesis ( shs ), chemical and physical vapor deposition ( cvd and pvd ), electrodeposition, laser cladding method, plasma sputtering and sol - gel method have been studed. metal organic chemical vapor deposition ( mocvd ), using chemical vapor deposition of metal organic compounds, is an effective method for acquiring special function materials and membrane
功能梯度材料是21世紀最有發展前景的新型材料之一，其用途已由原來的宇航工業，擴大到核能源、電子、化學、生物醫學等領域；其組成也由金屬?陶瓷發展成為金屬?金屬、金屬?合金、非金屬?非金屬、非金屬?陶瓷等多種組合；其制備方法主要包括粉末冶金法，自蔓延高溫合成法（ shs ） 、氣相沉積法（ cvd和pvd ） 、電沉積法，激光熔覆法，溶膠?凝膠法（ sol - gel ）等。 -
Rf magnetron sputtering that has been broadly used to fabricate a variety of thin films is a kind of physical vapor deposition ( pvd ), which consists of two main microscopic processes, one is the generation and transportation of the vapor phase particles to form the thin film, the other is the diffusion and aggregation of the film atoms on substrate, which leads to the formation of the film
射頻磁控濺射是一種物理氣相沉積技術，已被廣泛地用於各種薄膜的制備。它主要包括成膜氣相粒子（原子或分子）的產生和輸運以及輸運到襯底的成膜粒子在襯底上的擴散、聚集、生長成膜兩大過程。
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