polyimide film 中文意思是什麼
polyimide film
解釋
聚酰亞胺胺薄膜-
Mica tapes - polyimide film - backed mica paper tapes
雲母帶.聚酰亞胺薄膜粉雲母帶 -
Adhesive coated polyimide film for flexible printed circuits
撓性印製電路用塗膠聚酰亞胺薄膜 -
Furthermore the cells on polyimide can be fabricated by roll - to - roll processing and the high price of solar cells can be decreased. so the solar cells deposited on polymeric film substrate have a promising prospects. in this paper, we investigated the properties of thin film material deposited on polyimide
我們在原有玻璃襯底的pecvd工藝基礎上，對設備進行改進，使其適合於柔性襯底上的薄膜淀積；並且我們作了大量的實驗，探索柔性襯底上淀積薄膜材料的工藝參數。 -
Pmosfets and two 16 - bits shift registers were used as the impedance converting and address selection of the elements respectively. the thermal insulation layer was a polyimide film of five micrometers an
用pmos場效應管作熱釋電元件的阻抗轉換，用雙16位移位寄存器作敏感元件信號讀出的選址。 -
. materials for interconnection structures - sectional specification set for unreinforced base materials, clad and unclad intended for flexible printed boards - adhesive coated flexible polyimide film - adhesive coated flexible polyimide film
互聯結構材料.包被和非包被的非增強基材分規范集 -
Base material for printed circuits - specifications - flexible copper - clad polyimide film, general purpose grade
印製電路板基材.第2部分:規范.第13節:通用柔性覆銅聚酰亞胺膜 -
Base materials for printed circuits - part 2 : specifications ; specification no. 13 : flexible copper - clad polyimide film, general purpose grade iec 60249 - 2 - 13 : 1987 a1 : 1993 ; german version en 60249 - 2 - 13 : 1994 a1 : 1994
印製電路板基材.第2部分:規范.第13號規范:軟覆銅聚酰 -
The surface orientation technique applied most widely in industrial manufacture of lcd ( liquid crystal display ) is rubbing alignment technology, whose technique is to rubbing the polyimide ( pi ) film laid on glass substrate with rubbing clothes, meanwhile this technique fits to be used in laboratory very much, as its simple flow and good orientation effect
目前在工業上應用得最廣泛的是摩擦取向法，即用摩擦布沿一定的方向摩擦塗覆在玻璃基片表面的聚酰亞胺薄膜。這種方法因為其工藝簡單、取向效果好，非常適合實驗室應用。 -
Studies of the structural conversion and property change of polyimide film during the carbonization
膜碳化過程中結構和性能變化研究 -
Specifications for pressure - sensitive adhesive tapes for electrical purposes - specifications for individual materials - polyimide film tapes with pressure - sensitive adhesive
電氣用壓敏膠帶規范.單個材料規范.帶壓敏膠粘劑的聚酰亞胺膜帶 -
Evaluation of polyimide film developing level in china
我國聚酰亞胺薄膜製造技術發展水平的評估 -
Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
兩種聚酰亞胺薄膜光頻相對介電常數的測定 -
Base materials or printed circuits. part 2 : specifications. speciication no 13 : flexible copper - clad polyimide film, general purpose grade
印刷電路用基材.第2部分:規范. 13號規范:一般用途級包銅軟聚酰亞胺薄膜 -
Pressure - sensitive adhesive tapes for electrical purposes. part 3 : specifications for individual materials. sheet 7 : polyimide film tapes with pressure - sensitive adhesive
電工用壓敏膠帶.第3部分:專用材料規范.活頁7 :塗覆壓敏膠的聚酰亞胺薄膜膠帶 -
Copper - clad laminates for flexible printed wiring boards polyester film, polyimide film
柔性印製電路板用包銅層壓板 -
Pressure - sensitive adhesive tapes for electrical purposes - part 3 : specifications for individual materials - sheet 7 : polyimide film tapes with pressure - sensitive adhesive
電工用壓敏粘帶規范.第3部分:單項材料規范.第7活頁:聚酰亞胺薄膜粘帶
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