potting compound 中文意思是什麼

potting compound 解釋
封嚴劑
  • potting : n. 1. 陶器製造。2. 裝壺,裝瓶。3. 盆栽。
  • compound : vt 1 使混合,調合,配合;【語言學】復合,合成。2 (通過互相讓步等)解決(糾紛);用錢了結(債務等...
  1. New silicone flame retardant potting compound was prepared by blending of ltv silicone rubber as base gum with diluent, crystalline quartz filler, chain extension agent, crosslinking agent, inhibitor, carbon black and platinum catalyst

    以中溫硫化硅橡膠(以下簡稱ltv硅橡膠)為基膠,混入稀釋劑、石英粉、鏈增長劑、交聯劑、阻聚劑、炭黑及鉑催化劑等組分,制得新型有機硅阻燃灌封料。
  2. Abstract : new silicone flame retardant potting compound was prepared by blending of ltv silicone rubber as base gum with diluent, crystalline quartz filler, chain extension agent, crosslinking agent, inhibitor, carbon black and platinum catalyst

    文摘:以中溫硫化硅橡膠(以下簡稱ltv硅橡膠)為基膠,混入稀釋劑、石英粉、鏈增長劑、交聯劑、阻聚劑、炭黑及鉑催化劑等組分,制得新型有機硅阻燃灌封料。
  3. The effects of primary compounds on the property of the potting compound were studied and the optimum technological factors were determined

    討論了其主要組分對灌封料性能的影響,並確定了最佳工藝條件。
  4. Low viscosity, excellent electrical properties, used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry, can be used with various curing agents, thus varying pot life, cure time, mix ratios and cure conditions

    低粘度,有著出色的電氣性能,廣泛地應用為高壓灌封化合物和精密電路密封化合物,可與多種催化劑使用,可改變灌膠時間、固化時間、混合比率以及固化條件。
  5. Semi - flexible, potting compound that exhibits excellent electrical and physical properties over a wide range of temperatures

    半彈性灌封化合物,在很大的溫度范圍內都能保持良好的物理、電氣性能。
  6. Pourable rtv silicone potting / casting compound with high thermal conductivity, cures to firm but flexible rubber, capable of withstanding temperatures of 260 continuous and 315 short term exposure, uses in electronic devices requiring heat dissipation

    易澆注的rtv硅膠灌注化合物,高導熱,固化成穩固又有彈性的橡膠體,能持續耐溫260 ,短時間耐溫315 ,用於需散熱的電子設備。
  7. Low cost, easy to use room temperature curing epoxy potting and casting compound, with a mix ratio of 1 to 1 by volume, the cured epoxy is a tough rigid plastic that is highly suited to most electrical or electronic potting and encapsulating applications

    低成本,易使用的室溫固化環氧灌封化合物,簡單的混合比,固化后形成堅固的塑膠體可滿足大多數電子、電氣的灌封密封需要。
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