printed-circuit defect 中文意思是什麼
printed-circuit defect
解釋
印製電路缺陷-
At recent decade, accompany with surface mount technology printed - circuit board to produce fly of automation degree to soon develop, as to it ' s correspond of mass defect the inspection also put forward higher request, from in brief shoot to be like system to complicated " 3 - d " x optics to examine system, the automatic optical inspection is in great quantities adopt by the each production factory house
摘要在最近十年，伴隨著表面貼裝印刷電路板生產自動化程度的飛速發展，對其相應的質量缺陷檢查也提出了更高的要求，從簡單的攝像系統到復雜的" 3 - d " x光檢測系統，自動光學檢測系統大量被各生產廠家採用。 -
This text analyzed the application of automatic optical inspection from defect analysis and defect category and the process everyone ' s noodles of the defect inspection of surface mount technology printed - circuit board
本文從表面貼裝印刷電路板的缺陷分析和缺陷種類及缺陷檢查過程各方面分析了自動光學檢測系統的應用。 -
With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility
隨著微電子產品（集成電路晶元、印刷電路板等）向著高密度、細間距和低缺陷方向發展，對其檢測技術在精密、高效、通用和智能化等方面提出了更高要求。由此，本文對微電子產品視覺檢測中的關鍵技術進行研究，彌補了傳統檢測在精確快速定位、圖像全景組合和精細缺陷檢測等方面的不足，最終完成基於機器視覺的微電子產品外形尺寸和缺陷檢測的理論研究和樣機研製，並進行了大量實驗證明其正確性和可行性，力圖為我國自主創新的微電子產品視覺檢測技術提供理論和實際借鑒。
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