semiconductor array 中文意思是什麼

semiconductor array 解釋
半導體陣列
  • semiconductor : n. 【物理學】半導體。
  • array : vt 1 打扮，裝飾。2 使…列隊，排列。3 提出（陪審官）名單，使（陪審官）列席，召集（陪審官）。n 1 整...
  1. In the array scheme of with the diaphragm, the optimization of semiconductor optoelectric devices array forms a sky screens. while the bullel passing through the sky screens, the outputs of optoelectronic devices are amplified and coded, and then transmitted to the computer for processing

    半導體光電件陣列方案是將半導體器件陣列和光闌合理配置，形成天幕，將彈丸過靶信號光電轉換、放大，經過編碼處理，最後送入計算機處理。
  2. The light guiding unit on the surface is composed of sub - micron gratings whose transmission wavelengths are red, green and blue in order. the light source are red 、 green 、 blue led or semiconductor laser array. to enhance the light utilization, the surfaces of light guide plate except the incident and transmitted surfaces are coated with metallic film

    本文設計的亞微米光柵型導光板為矩形狀的，導光板上表面的導光單元是由三套出射光主波長分別是紅光632 . 8nm ，綠光521nm ，藍光441 . 6nm的亞微米光柵組成，光源採用的是紅、綠、藍三色發光二級管或者半導體激光器陣列，為了提高光能利用率，除入光面和出光面外，導光板其餘面都鍍上金屬膜。
  3. Testing of semiconductor materials ; measurement of the resistivity of silicon or germanium single crystals by means of the four probe direct current method with collinear array

    半導體材料的試驗.用探針直線排列的四探針直流法測
  4. It is used in solar cells and semiconductor detectors for astrophysical research, for x - ray fluorescence ( xrf ) analysis, industrial gauging, nuclear proliferation treaty verifaction et. al, and also in laser window and infrared array technology as subtriate for hg1 - xcdxte

    同時它還可作為紅外探測器材料碲鎘汞（ hgcdte ）和外延襯底，以及激光窗口和太陽電池等。
  5. Superpower semiconductor laser array and its application

    高功率半導體激光器陣列及其應用
  6. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  7. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  8. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  9. After got the growth and structure parameters, we had fabricated the laser with these optimal parameters. after a series of operations, we got the semiconductor laser array which was 1cm bar

    在確定了mocvd生長940nm量子阱激光器材料的最佳生長參數和結構參數后，我們將這些結果應用於激光器的製作，經過一系列工藝過程，得到條長1cm的半導體激光器陣列。
  10. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type

    半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形
  11. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  12. Gate array design generals for semiconductor integrated circuits

    半導體集成電路門陣列設計總則
  13. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array

    半導體器件機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小螺距球柵陣列的設計指南
  14. General seminconductor, inc. is a market leader in the discrete segment of the semiconductor industry with manufacturing facilities in china, france, germany, united states, etc. the company provides customers with a broad array of power rectifiers, transient voltage suppressors and small signal transistors and diodes

    通用半導體有限公司是世界上半導體切片工業的領導者，它的製造廠遍及中國、法國、德國、美國等國家。公司提供多種多樣的整流器、瞬態電壓消除器、小信號晶體管以及二極體。
  15. Flga. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type

    半導體裝置的機械標準化.表面安裝的半導體器件封裝圖形圖繪制的一般規則.細微間距柵級陣列
  16. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距球面柵格排列的設計指南
  17. Scalable optical switch array based on semiconductor optical amplifier

    基於半導體光放大器的可擴展型光開關矩陣
  18. A semiconductor diode array that is programmed by fusing or burning out diode junctions

    一種半導體二極體陣列，通過熔斷或燒斷二極體的結來實現編程過程。
  19. Flag. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小爆距紋間表面網格陣列
  20. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.焊球網格陣列封裝尺寸的測量方法
分享友人
分享到 Line

分享到臉書