semiconductor device 中文意思是什麼

semiconductor device 解釋
半導體器件
  • semiconductor : n. 【物理學】半導體。
  • device : n. 1. 設計，計劃；方法，手段。2. 〈pl. 〉意志，慾望。3. 謀略，策略，詭計。4. 器具，器械，設備，裝置。5. 圖案，圖樣；花樣；紋章；標記，商標；（紋章上的）題銘。
  1. In this dissertation, by virtue of self - developed test system, the studies on the optical and electric properties of oled of little molecule with different material, configuration manufactured with different processes have been presented. concepts of chromatics and the mechanism of carrier transportation in the semiconductor device have been applied here to qualitatively analysis and interpret the result of measurement. some interesting conclusions have been given which will be helpful in the further optimization of the performances of oled

    在oled研究過程中，對器件性能的表徵工作起到十分重要的作用，本文利用自主開發的測試平臺（包括軟體、硬體的搭建） ，對不同材料、結構、工藝的小分子oled器件進行了光學、電學性能的測試和評估，並依照色度學、半導體電輸運等理論成功的對測試結果作出了定性分析，揭示了制約器件工作性能的相關因素，為器件性能的進一步優化奠定了基礎、指明了方向。
  2. Heat sink for power semiconductor device part 2 : measuring method of thermal resistance and input fluid - output fluid pressure difference

    電力半導體器件用散熱器第2部分：熱阻和流阻測試方法
  3. Selecting guide of heat sink for power semiconductor device

    電力半導體器件用散熱器選用導則
  4. Electrotechnical terminology. power semiconductor device

    電工術語電力半導體器件
  5. One dimension cubic finite volume methods and analysis for the transient behavior of a semiconductor device

    半導體瞬態問題的一維三次有限體積方法及分析
  6. Heat sink for power semiconductor device part 1 : casting kind series

    電力半導體器件用散熱器第1部分：鑄造類系列
  7. Heat sink for power semiconductor device part 3 : insulators and fasteners

    電力半導體器件用散熱器第3部分：絕緣件和緊固件
  8. Semiconductor device passivation opening layouts

    半導體器件無源斷開電路設計
  9. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南
  10. Selection guidance of case for power semiconductor device

    電力半導體器件用管殼選用導則
  11. Case for power semiconductor device

    電力半導體器件用管殼
  12. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  13. The interface between two different semiconductor regions in a semiconductor device

    介面半導體裝置里兩個不同的半導體區之間的接合部
  14. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  15. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  16. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  17. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  18. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  19. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  20. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type

    半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形
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