semiconductor type 中文意思是什麼
semiconductor type
解釋
半導體類型- semiconductor : n. 【物理學】半導體。
- type : n 1 型,類型,(工業產品的)品種;風格,型式。2 典型,榜樣,樣本,樣板,模範,範本;典型人物;具...
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Bcd detail specification for electronic component. semiconductor integrated circuit. type ch2019 4 - line to 10 - line decoder with bcd - in
電子元器件詳細規范.半導體集成電路ch2019型4線- 10線譯碼器 -
In lab the most often used is electron multiplier and semiconductor type
實驗室常用的是電子倍增器和半導體型光二極體。 -
Semiconductor discrete device. detail specification for pnp silicon low - power transistor for type 3cg110gp gt and gct classes
半導體分立器件gp gt和gct級3cg110型pnp硅小功率晶體管.詳細規范 -
Semiconductor discrete device. detail specification for semiconductor opto - couplers for type gh21, gh22 and gh23 of gp, gt and gct classes
半導體分立器件. gp gt和gct級gh21 gh22和gh23型半導體光耦合器詳細規范 -
Semiconductor discrete device. detail specification for npn silicon high - frequency low - power transistor for type 3dg130gp gt and gct classes
半導體分立器件gp gt和gct級3dg130型npn硅高頻小功率晶體管.詳細規范 -
Semiconductor discrete device. detail specification for npn silicon low - power hiht - reverse - voltage transistor for type 3dg182gp gt and gct classes
半導體分立器件gp gt和gct級3dg182型npn硅小功率高反壓晶體管.詳細規范 -
Semiconductor optoelectronic devices detail specification for type gd101 pin photodiode
半導體光電子器件gd101型pin光電二極體詳細規范 -
Semiconductor optoelectronic devices detail specification for type gd3550y pin photodiode
半導體光電子器件gd3550y型pin光電二極體詳細規范 -
Semiconductor optoelectronic devices. delail specification for type gt16 si. npn phototransistor
半導體光電子器件gti6型硅npn光電晶體管詳細規范 -
Detail specification for electronic component. semiconductor integrated circuit - type cd3220cp dual preamplifier with alc
電子元器件詳細規范.半導體集成電路cd3220cp型帶alc雙前置放大器 -
Detail specification for electronic components. semiconductor integrated circuit - cf3080 type transconductance operational amplifier
電子元器件詳細規范.半導體集成電路cf 3080型跨導運算放大器 -
Semiconductor discrete device. detail specification for silicon tuning varactor diode for type 2cc51e
半導體分立器件. 2cc51e型硅電調變容二極體詳細規范 -
Semiconductor photoelectric assembly detail specification for miniature duplex photoelectric localizer for type cbgs 2301
半導體光電組件. cbgs2301微型雙向光電定位器.詳細規范 -
Semiconductor integrated circuits. detail specification for type jf3140 and jf3140a bimos operational amplifiers with high input impedence
半導體集成電路. jf3140 jf3140a型bimos高輸入阻抗運算放大器詳細規范 -
The housing device of this generic type for accommodating at least one circuit arrangement, in particular a power semiconductor module or the like, has housing areas which are designed for the arrangement of, in particular, live contact elements and which each provide a number of arrangement positions for this purpose
這種通用普通類型的外殼器件至少用於裝填一個電路裝置,特別是電源半導體模塊或類似物,在該外殼器件中設計有外殼區域,該外殼區域尤其是用來放置帶電的接觸單元,並且其每個都提供有多個此類放置位置。 -
A trend of photo - induced electron transition from p - type pc to n - type organic semiconductor was strongly supported by the data of sps and fisps measurements, the wire - like configuration of the tio2 tubule nanostructure benefited the electron - transport thereby improved the efficiency of the disassociation of the photogenerated carriers
表面光電壓測試結果表明,復合材料中存在著強烈的從p -型酞菁材料到n -型氧化物半導體材料的光致電荷轉移。而且tio _ 2的納米管和線狀結構提高了電子的傳輸效率最為明顯,使光生電荷的分離得到顯著改善。 -
Detail specification for electronic component. semiconductor integrated circuit. type ch2021 4 - bit up down synchronous binary counter dual clock
電子元器件詳細規范.半導體集成電路ch2021型4位二進制同步加減計數器 -
It is well known that wo3 is a conductance - type semiconductor gas sensing material, but the research on fish freshness detector with wo3 - based gas sensor to trimethylamine is still at a beginning stage. in this project, the wo3 - based gas sensors to trimethylamine are made, and their gas sensing performance are researched, especially at low temperature, the results are as follows : 1. the nano - sized wo3 powder is prepared by sol - gel method of sodium tungstate and hydrochloric acid, and its microstructure is analyzed by using xrd, sem and tem, for material ’ s microstructure is closely related to gas sensing performance
本課題制備了wo3材料,並以它為基材,製作了三甲胺氣敏傳感器,研究了其對三甲胺的氣敏性能,尤其是低工作溫度下的氣敏性能,得到結果如下: 1 、本課題以鎢酸鈉和濃鹽酸為反應物,用溶膠凝膠法制備了納米wo3材料,並採用x射線衍射分析儀( xrd ) ,掃描電鏡( sem ) ,透射電鏡( tem )對該材料進行結構分析和形貌觀察,研究發現材料的微觀結構與氣敏性能緊密相關。 -
When a metal is brought into contact with an n-type semiconductor, electrons will flew from the semi-conductor to the metal.
使一塊金屬與n型半導體接觸時,電子將從半導體流到金屬。 -
It was found that, the as grown crystal of mnxcd1 - xin2te4 is p type semiconductor, both the charge density and the resistivity increase with x value, while the carrier mobility decreases with x
晶體的電學性能,發現生長態的mncd晶體均為p型半導體。隨著組分x值的增大,載流於的濃度np減小,遷移率p 。
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