solder bump 中文意思是什麼

solder bump 解釋
焊料隆起焊盤
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • bump : vi 1 碰，撞，沖撞 （against into） 2 （笨重車子在壞路上）嘎噔嘎噔地走，顛簸 （along） bump agains...
  1. To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads

    為了獲得要求的凸起高度，錫膏在晶片焊盤過焊。
  2. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure

    在下一個迴流工序，錫膏浸潤焊盤表面，形成一個固態錫膏凸起。
  3. Figure 5. transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity

    圖5 ，錫高轉移的效率與孔面積比率及它對迴流峰共面度的影響。
  4. Current research on the reaction between solder bump and under bump metallurgy systems in flip chip

    倒裝晶元中凸點與凸點下金屬層反應的研究現狀
  5. With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher

    隨著電子產品之微小化，焊料凸塊的尺寸越來越小，而焊料凸塊的電流密度也隨之增大。
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