standardization of forms 中文意思是什麼
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Article 11 the state shall formulate unified statistical standards to ensure standardization of definitions of statistical items, computing methods, classification catalogues, investigation forms and statistical coding employed in statistical investigations
第十一條國家制定統一的統計標準，以保障統計調查中採用的指標涵義、計算方法、分類目錄、調查表式和統計編碼等方面的標準化。 -
Abstract : this paper calculates and analyses the stress distributing rule of the driving drum of belt conveyor by using ansys software, and investigates the usual destroying forms of it in theory, and provides essential theoretic gist for improving its suffering force situation and realizing its standardization production
文摘:採用大型有限元分析軟體ansys ，對帶式輸送機驅動滾筒的應力分佈規律進行了計算和分析，從理論上對滾筒的常見破壞形式進行了分析研究，為進一步改進滾筒的受力狀況，實現滾筒的標準化生產提供了必要的理論依據。 -
They should fjirmly hold to the principles of going by laws, paid labor, and voluntariness, and enthusiastically establish and perfect the transfer mechanism of rural farmland management rights, so as to realize the diversity of transfer forms, the standardization of transfer procedures, the rationalization of transfer compensation, the dynamic transference mechanism and the scientific transfer management. that can facilitate reasonable disposition of land resources, thus ensure a steady, stable and sound development of the rural economy
指出各級政府應該根據形勢發展的需要，把進一步深化農村改革的重點放在完善土地承包工作上，在穩定家庭聯產責任制的基礎上，牢牢把握「依法、有償、自願」等原則，積極建立和完善土地經營權流轉機制，真正實現流轉形式多樣化，流轉手續規范化，流轉補償合理化，流轉機制動態化和流轉管理科學化，促進土地資源的合理配置。 -
Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages
半導體器件的機械標準化.半導體器件封裝外殼形式的分類和編碼系統 -
Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages
半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統 -
Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2
半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統.修改件2 -
Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1
半導體器件的機械標準化.第4部分:半導體器件封裝外形圖類型的劃分和編號系統.修改件1
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