surface mount technology 中文意思是什麼
surface mount technology
解釋
表面安裝（裝配）技術- surface : n 1 表面；地面；水面；廣場，空地。2 外觀，外表，皮毛。3 【幾】面；切口；【航空】翼面。adj 表面的...
- mount : vt 1 登 上（山、梯、王位等）。2 騎 乘（馬等）。3 使人騎上（馬） 扶上（馬）；使做騎兵。4 安裝 裝配...
- technology : n. 1. 技術，工程，工藝。2. 製造學，工藝學。3. 術語（匯編）。
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At recent decade, accompany with surface mount technology printed - circuit board to produce fly of automation degree to soon develop, as to it ' s correspond of mass defect the inspection also put forward higher request, from in brief shoot to be like system to complicated " 3 - d " x optics to examine system, the automatic optical inspection is in great quantities adopt by the each production factory house
摘要在最近十年，伴隨著表面貼裝印刷電路板生產自動化程度的飛速發展，對其相應的質量缺陷檢查也提出了更高的要求，從簡單的攝像系統到復雜的" 3 - d " x光檢測系統，自動光學檢測系統大量被各生產廠家採用。 -
During these years, the main fact of surface mount technology ( smt ) industry is the shorter produce period, the shorter time of product which put in market, the smaller produce batch, the more new technology
競爭日益激烈、產品投放市場的時間日益縮短、生產周期越來越短、生產批量越來越小、新技術不斷引入，這些是表面貼裝技術（ smt ）行業所存在的不爭的事實。 -
Usage of real - time image recognition technology in surface mount components taping machine
實時圖像識別技術在片式元件編帶機中的運用 -
This text analyzed the application of automatic optical inspection from defect analysis and defect category and the process everyone ' s noodles of the defect inspection of surface mount technology printed - circuit board
本文從表面貼裝印刷電路板的缺陷分析和缺陷種類及缺陷檢查過程各方面分析了自動光學檢測系統的應用。 -
Surface mount technology, smt
表面黏著技術 -
General requirements for workmanship of surface mount technology
表面組裝工藝通用技術要求 -
On the basis of virtual evolving technology of surface mount technology ( smt ) for the solder joints, design for manufacturing ( dfm ) is employed, and dfm - oriented smt virtual assembly system targeted at assembly quality and solder joint reliability is developed
摘要在表面組裝技術焊點虛擬成形技術的基礎上，運用面向製造的設計思想，以表面組裝技術組裝質量與焊點可靠性為目標，研究面向表面組裝技術生產組裝工藝設計的產品虛擬組裝系統。 -
Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method
環境試驗規程.第2部分:試驗方法.第69節:試驗te :潤濕平衡法試驗表面鑲嵌技術用電子元件軟釬焊 -
Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method
基本環境試驗規程.第2部分:試驗.第69節:試驗te :潤濕平衡法對表面鑲嵌技術用電子元件的軟釬焊試驗 -
Standard surface - mount technology or through - hole techniques provide adequate performance
標準表面貼裝技術或通孔技術提供足夠的性能。 -
Terminology for surface mount technology
表面組裝技術術語 -
Ic and optoelectronics packaging ; flip chip technology ; surface mount technology
集成電路及光電子封裝；倒扣晶元技術；表面貼裝技術 -
Environmental testing. part 2 : tests. test te : solderability testing of electronic components for surface mount technology by the wetting balance method
環境試驗.第2部分:試驗. te試驗:用加濕平衡法測試表面安裝技術的電子元件的可焊性 -
Based on current situation, background and developping feature of airborne avionics, aiming at development and manufacturing process of new avionics products in our institute, the current manufacturing management status and issues are analyzed in this paper, some suggestions on further developping of surface mount technology and production line program are given
從我國當前的製造業形勢、背景及航空微電子製造技術的發展特點出發，結合我所新產品開發和製造流程分析了當前的生產管理狀況，對航空業進一步發展表面組裝技術及其流水線規劃和生產管理流程再造提出了建設性的方法和途徑。
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